Solid-state imaging device, imaging system, and imaging method

    公开(公告)号:US11871134B2

    公开(公告)日:2024-01-09

    申请号:US17598532

    申请日:2020-02-05

    Applicant: TOPPAN INC.

    Inventor: Takashi Watanabe

    CPC classification number: H04N25/75 H04N25/705 H04N25/77 H04N25/46

    Abstract: [Problem] To provide a solid-state imaging device enabling summed-readout mode and cyclic-readout mode.
    [Solution]
    A device includes virtual-pixel units implemented by pixels of transfer-route controlling-scheme, the virtual-pixel units having a shape of polygon, the polygons are tessellated. The virtual-pixel unit encompasses a photoelectric-conversion region, charge detectors to which ordinal numbers are labeled, configured to accumulate signal charges transferred from the photoelectric-conversion region, and transfer-control elements configured to control movement of signal charges from the photoelectric-conversion region to one of the charge detectors. N pieces of charge detectors of the same ordinal number are arranged in boundary between the photodiodes and the intersection-shared sites. The intersection-shared site encompasses N pieces of switching elements having first main electrode connected to the charge detectors, and common signal-readout circuit having input terminals connected to second main electrode of each of the switching elements.

Patent Agency Ranking