公开(公告)号：US20230240009A1

公开(公告)日：2023-07-27

申请号：US18127295

申请日：2023-03-28

Applicant: TOPPAN INC.

Inventor： Takeshi TAKADA ,  Yuki UMEMURA

IPC: H05K1/09 ,  H05K3/42

CPC classification number: H05K1/09 ,  H05K3/42 ,  H05K2201/0137 ,  H05K2203/072 ,  H05K3/46

Abstract: A wiring board includes a first wiring layer disposed on the first adhesion layer; and a second wiring layer disposed on the second adhesion layer, wherein a proportion of copper remaining in the first wiring layer is represented by C=B/A (%), where A is a total area of the first wiring layer, B is an area of copper in the first wiring layer, and C is a remaining copper ratio C defined as the proportion of copper remaining in the first wiring layer, and wherein when the remaining copper ratio C is set to 70 to 100%, the first adhesion layer is comprised of at least one material having a first predetermined Young's modulus, and the first wiring layer is comprised of at least one material having a second predetermined Young's modulus, the first predetermined Young's modulus being 0.1 to 0.85 times the second predetermined Young's modulus.