Grounding structure formed of resin material

    公开(公告)号:US10278316B2

    公开(公告)日:2019-04-30

    申请号:US15874522

    申请日:2018-01-18

    发明人: Sho Endoh

    摘要: A grounding structure for a vehicle provided with a floor portion formed of a resin material includes a sheet-shaped wiring sheet including a conductive material for electrical connection between an electric power supply and an electronic component and a sheet-shaped conductive portion electrically connected to a grounding potential. The conductive portion includes a part disposed to overlap a surface of the wiring sheet on an inner portion side of the vehicle.

    Grounding structure formed of resin material

    公开(公告)号:US10259409B2

    公开(公告)日:2019-04-16

    申请号:US15874464

    申请日:2018-01-18

    发明人: Sho Endoh

    摘要: A grounding structure for a vehicle provided with a floor portion formed of a resin material includes a sheet-shaped wiring sheet including a conductive material for electrical connection between an electric power supply and an electronic component and a sheet-shaped conductive portion electrically connected to a grounding potential. The conductive portion includes a part disposed to overlap a surface of the wiring sheet on an outer portion side of the vehicle.