Duplex imaging apparatus
    1.
    发明授权
    Duplex imaging apparatus 有权
    双面成像装置

    公开(公告)号:US06222606B1

    公开(公告)日:2001-04-24

    申请号:US09359798

    申请日:1999-07-26

    IPC分类号: G03B2732

    摘要: Premising a duplex imaging apparatus having an image carrier provided with a plurality of image carrying regions, the image deterioration phenomenon (i.e., the so-called “oil ghost phenomenon”), as might otherwise accompany the local transfer of a releasing agent from a fixing unit to the image carrier, is effectively avoided. In a mode where the image carrier 2 is provided with the plural image carrying regions, duplex mode control unit 8 includes an imaging sequence determining portion 9 for determining such a fundamental imaging sequence that when duplex images are to be formed on sheets 4 more than an image carriable number of the image carrier 2, the fundamental sequence determining portion 9 causes the image carrier 2: to carry first screen images A less than the image carriable number in a first imaging cycle of an imaging unit 1; to carry images corresponding to the image carriable number in and after a second imaging cycle so that at least second screen images B may be positioned at the front of the first screen images A; and to carry the second screen images B less than the image carriable number in the last imaging cycle.

    摘要翻译: 提供具有设置有多个图像承载区域的图像载体的双面成像装置,图像劣化现象(即所谓的“油重影现象”)可能伴随着脱模剂从固定的局部转移 单元到图像载体,被有效地避免。 在图像载体2设置有多个图像承载区域的模式中,双面模式控制单元8包括用于确定这样的基本成像序列的成像序列确定部分9,即当在多于4个的片材4上形成双面图像时 图像载体2的图像载体号,基本序列确定部分9使图像载体2在成像单元1的第一成像周期中携带小于图像载体数量的第一屏幕图像A; 以在第二成像周期中和之后携带与图像可载卡号相对应的图像,使得至少第二屏幕图像B可以位于第一屏幕图像A的前面; 并且在最后一个成像周期中携带第二屏幕图像B小于图像可携带号码。

    Fuser for two-sided imager
    2.
    发明授权
    Fuser for two-sided imager 有权
    双面成像器的定影器

    公开(公告)号:US06173136B2

    公开(公告)日:2001-01-09

    申请号:US09365802

    申请日:1999-08-03

    IPC分类号: G03G1520

    摘要: Image deterioration (so-called oil ghost) due to local transfer of a release agent from a fuser to an intermediate transfer body is effectively prevented. The fuser has a pair of fixing members, a release supply mechanism, an interlocking mechanism, and an interlocking control mechanism. The fixing members are in contact with each other and roll over each other, thus nipping a sheet. The fixing members fix unfixed images on the sheet. The release agent supply mechanism is mounted to at least the fixing member located on the surface of the sheet carrying an unfixed image. The release agent supply mechanism supplies a release agent to this fixing member at a constant rate. The interlocking mechanism interlocks the fixing members and release agent supply mechanism with each other such that the fixing members are kept in contact with each other and roll over each other and that a release agent is supplied to the fixing members. When duplex mode is selected, the interlocking control mechanism controls the interlocking time of the interlocking mechanism according to the length of the path of the sheet going to the nip between the fixing members.

    摘要翻译: 有效地防止了由于脱模剂从定影器局部转移到中间转印体而导致的图像劣化(所谓的油重影)。 定影器具有一对固定构件,释放供给机构,联锁机构和互锁控制机构。 固定构件彼此接触并且彼此滚动,从而夹住片材。 固定构件将未固定的图像固定在片材上。 脱模剂供给机构至少安装在位于载有未定影图像的片材的表面上的固定构件。 脱模剂供给机构以一定的速度向该固定部件供给脱模剂。 互锁机构将固定部件和脱模剂供给机构互相联结,使得固定部件保持彼此接触并且彼此滚动,并且将脱模剂供给到固定部件。 当选择双面模式时,互锁控制机构根据到达固定构件之间的辊隙的片材的路径的长度来控制互锁机构的联锁时间。

    Method of manufacturing semiconductor devices

    公开(公告)号:US07054705B2

    公开(公告)日:2006-05-30

    申请号:US10044964

    申请日:2002-01-15

    IPC分类号: G06F19/00

    摘要: A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.

    Semiconductor device manufacturing system and method of manufacturing semiconductor devices
    4.
    发明授权
    Semiconductor device manufacturing system and method of manufacturing semiconductor devices 有权
    半导体器件制造系统和半导体器件的制造方法

    公开(公告)号:US06349240B2

    公开(公告)日:2002-02-19

    申请号:US09814871

    申请日:2001-03-23

    IPC分类号: G06F1900

    摘要: A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.

    摘要翻译: 提供了一种半导体器件制造系统,其中读取芯片位置信息而不从包装中去除树脂,从而可以快速识别和去除故障的原因,并且可以快速提高芯片的产量。 替换地址读取装置从在半导体器件被封装到封装中之后执行的测试中被确定为有故障的半导体器件中读取冗余地址。 芯片位置分析装置从这些冗余地址的组合估计有缺陷的半导体器件的批号,晶片号和芯片数。 故障分布映射设备根据这样获得的数据,对批次中每个晶片中的故障芯片的分布进行映射。 故障原因确定装置基于上述分布来识别哪个制造装置或处理步骤已经导致晶片过程中的故障。