摘要:
Premising a duplex imaging apparatus having an image carrier provided with a plurality of image carrying regions, the image deterioration phenomenon (i.e., the so-called “oil ghost phenomenon”), as might otherwise accompany the local transfer of a releasing agent from a fixing unit to the image carrier, is effectively avoided. In a mode where the image carrier 2 is provided with the plural image carrying regions, duplex mode control unit 8 includes an imaging sequence determining portion 9 for determining such a fundamental imaging sequence that when duplex images are to be formed on sheets 4 more than an image carriable number of the image carrier 2, the fundamental sequence determining portion 9 causes the image carrier 2: to carry first screen images A less than the image carriable number in a first imaging cycle of an imaging unit 1; to carry images corresponding to the image carriable number in and after a second imaging cycle so that at least second screen images B may be positioned at the front of the first screen images A; and to carry the second screen images B less than the image carriable number in the last imaging cycle.
摘要:
Image deterioration (so-called oil ghost) due to local transfer of a release agent from a fuser to an intermediate transfer body is effectively prevented. The fuser has a pair of fixing members, a release supply mechanism, an interlocking mechanism, and an interlocking control mechanism. The fixing members are in contact with each other and roll over each other, thus nipping a sheet. The fixing members fix unfixed images on the sheet. The release agent supply mechanism is mounted to at least the fixing member located on the surface of the sheet carrying an unfixed image. The release agent supply mechanism supplies a release agent to this fixing member at a constant rate. The interlocking mechanism interlocks the fixing members and release agent supply mechanism with each other such that the fixing members are kept in contact with each other and roll over each other and that a release agent is supplied to the fixing members. When duplex mode is selected, the interlocking control mechanism controls the interlocking time of the interlocking mechanism according to the length of the path of the sheet going to the nip between the fixing members.
摘要:
A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.
摘要:
A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.