公开(公告)号：US11525739B2

公开(公告)日：2022-12-13

申请号：US15973964

申请日：2018-05-08

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Steven Aldred Kummerl ,  Steve Edward Harrell

IPC: H01C7/10 ,  G01K1/08 ,  H01C7/00 ,  G01K7/24 ,  H01C1/01 ,  H01C1/034 ,  H01C17/00

Abstract: A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.