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公开(公告)号:US09880522B2
公开(公告)日:2018-01-30
申请号:US14367655
申请日:2012-12-20
Inventor: Thierry Hessler , Nicolas Rebeaud , Jean-Luc Helfer , David Richard , Sebastien Graf
IPC: G04B31/00 , G04B31/06 , G04B31/02 , G04B31/08 , B23K26/00 , G04B31/004 , F16C17/06 , F16C17/03 , F16C33/10 , G04B15/14 , G04D3/00
CPC classification number: G04B31/06 , B23K26/57 , F16C17/03 , F16C17/06 , F16C33/10 , G04B15/14 , G04B31/00 , G04B31/004 , G04B31/02 , G04B31/08 , G04D3/0069 , G04D3/0071
Abstract: A method for manufacturing a component in a substrate including: a) modifying a structure of at least one region of the substrate to make the at least one region more selective; and b) chemically etching the at least one region to selectively manufacture the component.