LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号:US20120291270A1

    公开(公告)日:2012-11-22

    申请号:US13562544

    申请日:2012-07-31

    Abstract: A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

    Abstract translation: 多个具有印刷带状内部电极图案的陶瓷生片层叠,厚度部分重叠,厚部分重叠,每个陶瓷生片均具有宽度方向中央的厚部和厚部的各宽度方向侧的薄壁部分 不要重叠,形成未烧的母体层压体。 该未烧结的母体层叠体沿着彼此垂直的预定切割线切割,以获得多个未烧制的陶瓷元件组件。 通过涂覆陶瓷膏以覆盖暴露于侧面的内部电极图案的暴露部分,在第一内部电极图案与未烧制的陶瓷元件组件的第一和第二侧表面之间以及在第二内部电极图案和第一内部电极图案之间形成侧面间隙区域 和第二侧面。

    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号:US20100085682A1

    公开(公告)日:2010-04-08

    申请号:US12570399

    申请日:2009-09-30

    Abstract: A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

    Abstract translation: 多个具有印刷带状内部电极图案的陶瓷生片层叠,厚度部分重叠,厚部分重叠,每个陶瓷生片均具有宽度方向中央的厚部和厚部的各宽度方向侧的薄壁部分 不要重叠,形成未烧的母体层压体。 该未烧结的母体层叠体沿着彼此垂直的预定切割线切割,以获得多个未烧制的陶瓷元件组件。 通过涂覆陶瓷膏以覆盖暴露于侧面的内部电极图案的暴露部分,在第一内部电极图案与未烧制的陶瓷元件组件的第一和第二侧表面之间以及在第二内部电极图案和第一内部电极图案之间形成侧面间隙区域 和第二侧面。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20120073129A1

    公开(公告)日:2012-03-29

    申请号:US13241863

    申请日:2011-09-23

    CPC classification number: H01G4/232 H01G4/08 H01G4/30 Y10T29/49117

    Abstract: In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.

    Abstract translation: 在制造多层陶瓷电子部件的方法中,进行研磨,使得从绿色元件体的外表面延伸的交叉线和要形成的层叠部分的绿色芯片与陶瓷侧面层之间的界面各自位于 倒角部分的曲面形成范围。 因此,由于绿色陶瓷材料被延伸以填充界面,如所谓的“油灰”,并且要形成层压体部分的绿色芯片和每个陶瓷侧表面层之间的粘合强度增加。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号:US20120075766A1

    公开(公告)日:2012-03-29

    申请号:US13241875

    申请日:2011-09-23

    CPC classification number: H01G4/30 H01G4/005

    Abstract: In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface.

    Abstract translation: 在多层陶瓷电子部件中,虚设电极位于边缘区域中。 在面向元件主体的侧面的内部电极的面对部分的一侧的延伸线与面对侧面的内部电极的延伸部分的一侧之间的区域中,虚设电极被设置成不延伸 到面向侧面的一侧的延伸线。 虚拟电极包括沿与侧面平行或基本平行的方向直线延伸的多个电极片。

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