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公开(公告)号：US07022300B2
公开(公告)日：2006-04-04
申请号：US10618656
申请日：2003-07-15
申请人： Toshiya Matsubara , Masaharu Tanaka , Shin Tatematsu , Kazuhiko Yamada , Kenji Yamada , Kenichi Ebata , Hajime Katayama , Kentarou Tsunozaki
发明人： Toshiya Matsubara , Masaharu Tanaka , Shin Tatematsu , Kazuhiko Yamada , Kenji Yamada , Kenichi Ebata , Hajime Katayama , Kentarou Tsunozaki
IPC分类号： C01B33/12
CPC分类号： C01B33/124 , B01F3/0811 , B01F5/0475 , B01J13/06
摘要： A process for producing inorganic spheres, which comprises injecting an aqueous liquid containing an inorganic compound through an inlet hole into an organic liquid which flows at a flow rate of from 0.001 to 2 m/s in a laminar flow state in a flow path to form a W/O type emulsion, and solidifying the aqueous liquid containing an inorganic compound in the W/O type emulsion.
摘要翻译： 一种无机球体的制造方法，其特征在于，将含有无机化合物的含水液体通过入口孔注入到以流路为流量的0.001〜2m / s的有机液体中，形成流路 W / O型乳液，并且在W / O型乳液中固化含有无机化合物的含水液体。
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2.发明授权Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material 有权精细金属氢化物颗粒，它们的生产工艺，分散含有金属氢化物微粒和金属材料公开(公告)号：US07550513B2
公开(公告)日：2009-06-23
申请号：US11296321
申请日：2005-12-08
IPC分类号： C08J3/02
摘要： It is to provide fine particles of copper, nickel or palladium hydride having an average particle diameter of at most 50 nm, which are hardly oxidized in the atmosphere and are excellent in storage stability and are thereby very suitable for formation of metallic materials, and their production process. Further, it is to provide a dispersion containing fine particles of copper, nickel or palladium hydride, which is excellent in storage stability, and a metallic material obtained by applying the dispersion, followed by baking. The fine particles of copper, nickel or palladium hydride and the dispersion thereof, to be obtained by the present invention, are applicable to various applications, and they can be used for e.g. formation and repair of printed wiring, etc. employing a dispersion, interlayer wiring in semiconductor packages, and joining of printed wiring boards and electronic components.
摘要翻译： 本发明提供平均粒径为50nm以下的细小的铜，镍或钯氢化物颗粒，其在大气中几乎不被氧化，储存稳定性优异，因此非常适合金属材料的形成， 生产过程。 此外，提供一种含有保存稳定性优异的铜，镍或氢化钯微粒的分散体，以及通过涂布分散体得到的金属材料，然后进行烘烤。 通过本发明获得的铜，镍或氢化钯的细颗粒及其分散体可应用于各种应用，它们可以用于例如， 使用分散体的印刷布线的形成和修复，半导体封装中的层间布线，以及印刷线路板和电子部件的接合。
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公开(公告)号：US20060070493A1
公开(公告)日：2006-04-06
申请号：US11296321
申请日：2005-12-08
摘要： It is to provide fine particles of copper, nickel or palladium hydride having an average particle diameter of at most 50 nm, which are hardly oxidized in the atmosphere and are excellent in storage stability and are thereby very suitable for formation of metallic materials, and their production process. Further, it is to provide a dispersion containing fine particles of copper, nickel or palladium hydride, which is excellent in storage stability, and a metallic material obtained by applying the dispersion, followed by baking. The fine particles of copper, nickel or palladium hydride and the dispersion thereof, to be obtained by the present invention, are applicable to various applications, and they can be used for e.g. formation and repair of printed wiring, etc. employing a dispersion, interlayer wiring in semiconductor packages, and joining of printed wiring boards and electronic components.
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