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1.发明授权公开(公告)号：US09333558B2
公开(公告)日：2016-05-10
申请号：US13779803
申请日：2013-02-28
Inventor： Kristopher A. Darling , Laszlo J. Kecskes , Brady G. Butler
CPC classification number: B22F9/04 , B02C17/1815 , B02C17/20 , B02C23/00 , B02C23/06 , B22F1/0018 , B22F2009/043 , B22F2009/049 , B22F2999/00 , C22C1/0425 , C22C9/00 , F42B1/032 , B22F2202/03
Abstract: A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.
Abstract translation: 根据本发明的实施方案的二元或更高阶高密度热力学稳定的纳米结构铜 - 钽基金属体系可以由以下物质形成：铜（Cu）金属的溶剂，其包含70至100原子％（原子百分比） 金属系统 以及分散在溶剂金属中的钽（Ta）金属溶质，其含有0.01〜15at。 ％的金属系统。 金属体系是热稳定的，不存在实质的总晶粒生长，使得溶剂金属的内部晶粒尺寸在溶剂金属的熔点温度的约98％时基本上被抑制到不超过约250nm，并且 在该温度下，溶质金属基本均匀地分散在溶剂金属中。 用于形成这些金属体系的方法可以包括：使用高能研磨装置对溶剂的粉末金属和溶质进行高能量研磨工艺，以赋予其内容物高的冲击能。 由于它们的高密度热力学稳定的纳米结构，这些金属系统是制造用于法规的成形充电衬垫的理想候选者。
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2.发明申请BINARY OR HIGHER ORDER HIGH-DENSITY THERMODYNAMICALLY STABLE NANOSTRUCTURED COPPER-BASED TANTALUM METALLIC SYSTEMS, AND METHODS OF MAKING THE SAME 有权二级或更高级别的高密度热稳定的基于纳米结构的铜基金属系统及其制备方法公开(公告)号：US20150375301A1
公开(公告)日：2015-12-31
申请号：US13779803
申请日：2013-02-28
Inventor： Kristopher A. Darling , Laszlo J. Kecskes , Brady G. Butler
CPC classification number: B22F9/04 , B02C17/1815 , B02C17/20 , B02C23/00 , B02C23/06 , B22F1/0018 , B22F2009/043 , B22F2009/049 , B22F2999/00 , C22C1/0425 , C22C9/00 , F42B1/032 , B22F2202/03
Abstract: A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.
Abstract translation: 根据本发明的实施方案的二元或更高阶高密度热力学稳定的纳米结构铜 - 钽基金属体系可以由以下物质形成：铜（Cu）金属的溶剂，其包含70至100原子％（原子百分比） 金属系统 以及分散在溶剂金属中的钽（Ta）金属溶质，其含有0.01〜15at。 ％的金属系统。 金属体系是热稳定的，不存在实质的总晶粒生长，使得溶剂金属的内部晶粒尺寸在溶剂金属的熔点温度的约98％下基本上被抑制到不超过约250nm， 在该温度下，溶质金属基本均匀地分散在溶剂金属中。 用于形成这些金属体系的方法可以包括：使用高能研磨装置对溶剂的粉末金属和溶质进行高能量研磨工艺，以赋予其内容物高的冲击能。 由于它们的高密度热力学稳定的纳米结构，这些金属系统是制造用于法规的成形充电衬垫的理想候选者。
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