公开(公告)号：US20010003374A1

公开(公告)日：2001-06-14

申请号：US09730656

申请日：2000-12-06

Applicant: U.S. PHILIPS CORPORATION

Inventor： Marcel Rene Bohmer ,  Nicolaas Kooyman

IPC: B32B005/00 ,  H01L023/02

CPC classification number: H01L23/573 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/26 ,  H01L2924/00

Abstract: A semiconductor device (20) comprising a substrate (1) is provided with a first semiconductor element (3) on a first side (2), of the substrate and with a security coating (14) comprising a matrix, a first filler and a second filler. The second filler is an absorber of radiation of a wavelength of between 800 and 1400 nm and the refractive index of the first filler differs at least 0.3 from that of the matrix. As a result, the security coating inhibits transmission of radiation with a wavelength of between 400 and 1400 nm to a very large extent. The semiconductor device (20) can be incorporated in a smartcard.

Abstract translation: 一种包括衬底（1）的半导体器件（20）在衬底的第一侧（2）上设置有第一半导体元件（3），并具有包括矩阵，第一填充物和 第二填料。 第二填料是波长在800和1400nm之间的辐射吸收剂，第一填料的折射率与基质的折射率不同，至少为0.3。 结果，安全涂层在很大程度上抑制波长在400和1400nm之间的辐射透射。 半导体器件（20）可以结合在智能卡中。