公开(公告)号：US12061669B2

公开(公告)日：2024-08-13

申请号：US17343798

申请日：2021-06-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Ming-Tsung Yeh ,  Chuan-Guei Wang ,  Ji-Fu Kung

IPC: G06F18/2134 ,  G06F18/2137 ,  G06N5/04 ,  G06V20/62

CPC classification number: G06F18/21345 ,  G06F18/2137 ,  G06N5/04 ,  G06V20/635

Abstract: A manufacturing data analyzing method and a manufacturing data analyzing device are provided. The manufacturing data analyzing method includes the following steps. Each of at least one numerical data, at least one image data and at least one text data is transformed into a vector. The vectors are gathered to obtain a combined vector. The combined vector is inputted into an inference model to obtain a defect cause and a modify suggestion.