公开(公告)号：US11672178B2

公开(公告)日：2023-06-06

申请号：US17388012

申请日：2021-07-29

Applicant: UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION

Inventor： Sang Ii Kim

IPC: H01L35/32 ,  H01L35/34 ,  H01L35/16

CPC classification number: H01L35/32 ,  H01L35/16 ,  H01L35/34

Abstract: Provided is a thermoelectric element assembly including a soft support including a plurality of through-holes, and a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements inserted into a plurality of through-holes of the support, wherein a thickness of the support is less than a length of the thermoelectric element.