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公开(公告)号：US20190141842A1
公开(公告)日：2019-05-09
申请号：US15853990
申请日：2017-12-26
Applicant: Unimicron Technology Corp.
Inventor： Hsiang-Hung HUANG , Chi-Min CHANG
Abstract: A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.
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