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公开(公告)号：US20230180382A1
公开(公告)日：2023-06-08
申请号：US17577359
申请日：2022-01-17
Applicant: Unimicron Technology Corp.
Inventor： Chun-Lin LIAO , Pei-Chang HUANG
IPC: H05K1/02
CPC classification number: H05K1/0272 , H05K2201/10371 , H05K2201/0116
Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.
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Patent Agency Ranking
公开(公告)号：US20210144841A1
公开(公告)日：2021-05-13
申请号：US17153856
申请日：2021-01-20
Applicant: Unimicron Technology Corp.
Inventor： Chin-Sheng WANG , Pei-Chang HUANG
Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.
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公开(公告)号：US20220377874A1
公开(公告)日：2022-11-24
申请号：US17818004
申请日：2022-08-08
Applicant: Unimicron Technology Corp.
Inventor： Chin-Sheng WANG , Pei-Chang HUANG
Abstract: A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. A heat dissipation block is inserted in the opening to clamp the heat dissipation block between the first fixing portion and the second fixing portion, in which the heat dissipation block includes the heat dissipation block comprises a ceramic or a composite material.
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公开(公告)号：US20150362674A1
公开(公告)日：2015-12-17
申请号：US14490688
申请日：2014-09-19
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju CHEN , Cheng-Po YU , Pei-Chang HUANG
CPC classification number: G02B6/122 , G02B6/13 , G02B6/4203 , G02B6/4231 , G02B6/428 , Y10T29/49131
Abstract: A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.
Abstract translation: 光电路基板的组装方法如下所述。 在基底上有序地形成底部包层，芯层和顶部覆层，使得波导完成。 在基材中形成第一导光孔，在基材上设置光源，形成发光成分。 在另一个基材中形成第二导光孔，然后将光接收器设置在另一个基材上，从而形成接收器部件。 处理电路基板以在基板的第一电路层上形成第一空腔，第二空腔和第三空腔。 波导，发射部件和接收器部件分别设置在第一腔体，第二腔体和第三腔体中。
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公开(公告)号：US20200214120A1
公开(公告)日：2020-07-02
申请号：US16283849
申请日：2019-02-25
Applicant: Unimicron Technology Corp.
Inventor： Chin-Sheng WANG , Pei-Chang HUANG
Abstract: A method of manufacturing a circuit board having a heat dissipation block includes forming an opening through a substrate to form an open substrate. The opening has a first sidewall and a second sidewall opposite to each other, and the open substrate includes a substrate body surrounding the opening, at least one first fixing portion extending from the substrate body toward the opening and protruding from the first sidewall, and at least one second fixing portion extending from the substrate body toward the opening and protruding from the second sidewall. The heat dissipation block is then clamped between the first fixing portion and second fixing portion to fix the heat dissipation block in the opening.
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公开(公告)号：US20170129454A1
公开(公告)日：2017-05-11
申请号：US14936697
申请日：2015-11-10
Applicant: Unimicron Technology Corp.
Inventor： Pei-Chang HUANG , Cheng-Po YU
Abstract: A safety system for preventing a living body from being locked in a vehicle comprises a warning unit, a detection device and a limiting device. The detection device is disposed in a passenger's protection device which has to be used by a passenger when the vehicle is being driven. The detection device detects whether the passenger's protection device is in use or not to generate a corresponding detection signal. The warning unit turns on or turns off a warning device according to the detection signal and generates a corresponding control signal. The limiting device locks the vehicle key in the key slot or to release the vehicle key from the key slot according to the control signal after the vehicle has been parked.
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