公开(公告)号：US20220068742A1

公开(公告)日：2022-03-03

申请号：US17453489

申请日：2021-11-04

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Hui WU ,  Jeng-Ting LI ,  Ping-Tsung LIN ,  Kai-Ming YANG ,  Pu-Ju LIN ,  Cheng-Ta KO

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

Abstract: A chip package includes a redistribution layer, a chip, and an encapsulation member. The redistribution layer includes an insulation part, a plurality of first pads and a plurality of second pads, where the insulation part has a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. The first pads and the second pads are located at the first surface and the second surface respectively. The chip is disposed on the first surface and electrically connected to the first pads. The encapsulation member wraps the chip and the redistribution layer, and covers the first surface and the side surface, where the encapsulation member exposes the second pads, and the encapsulation member is not flush with the first surface and the side surface.