公开(公告)号：US20120161260A1

公开(公告)日：2012-06-28

申请号：US13334398

申请日：2011-12-22

申请人： Uwe HANSEN ,  Lutz Rauscher

发明人： Uwe HANSEN ,  Lutz Rauscher

IPC分类号： H01L29/84 ,  H01L29/66 ,  H01L21/56

CPC分类号： B81B7/0061 ,  H01L2224/48095 ,  H01L2224/48465 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.

摘要翻译： 引入了措施，使得具有媒体访问的传感器芯片的低成本封装成为可能。 为此，传感器芯片首先安装在基板上并被接触。 然后将传感器芯片至少部分地嵌入模塑料中。 最后，介质通道的至少一部分通过随后的模塑料的结构而产生。