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公开(公告)号：USD778247S1
公开(公告)日：2017-02-07
申请号：US29524104
申请日：2015-04-16
CPC分类号： H01L21/68771 , C23C16/4584 , H01L21/68721 , H01L21/68764
摘要： A wafer carrier including thirty-five pockets arranged on a top surface, configured to be used with a chemical vapor deposition device, is provided. The wafer carrier comprises: a body having a top surface and a bottom surface arranged opposite one another, and a plurality of pockets defined in the top surface of the wafer carrier, wherein the plurality of pockets consist of a total of thirty-five pockets, each of the pockets is arranged along one of three circles, and the three circles are concentric with one another and with a circular outline formed by a perimeter of the top surface.
摘要翻译： 提供了一种晶片载体，其包括配置成与化学气相沉积装置一起使用的顶表面上的三十五个凹穴。 晶片载体包括：主体，其具有彼此相对布置的顶表面和底表面，以及限定在晶片载体的顶表面中的多个凹穴，其中多个凹穴由总共三十五个凹穴组成， 每个凹穴沿着三个圆圈中的一个布置，并且三个圆圈彼此同心并具有由顶部表面的周边形成的圆形轮廓。
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公开(公告)号：USD860146S1
公开(公告)日：2019-09-17
申请号：US29627938
申请日：2017-11-30
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公开(公告)号：USD806046S1
公开(公告)日：2017-12-26
申请号：US29587929
申请日：2016-12-16
CPC分类号： H01L21/68771 , C23C16/4584 , H01L21/68721 , H01L21/68764
摘要： A wafer carrier including thirty-five pockets arranged on a top surface, configured to be used with a chemical vapor deposition device, is provided. The wafer carrier comprises: a body having a top surface and a bottom surface arranged opposite one another, and a plurality of pockets defined in the top surface of the wafer carrier, wherein the plurality of pockets consist of a total of thirty-five pockets, each of the pockets is arranged along one of three circles, and the three circles are concentric with one another and with a circular outline formed by a perimeter of the top surface.
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