公开(公告)号：US09796864B2

公开(公告)日：2017-10-24

申请号：US14471893

申请日：2014-08-28

Applicant: Xerox Corporation

Inventor： Yiliang Wu ,  Bryan A. Nerger

IPC: C09D11/102 ,  C09D163/00 ,  C08K5/06 ,  C08G59/06 ,  C08G65/00

CPC classification number: C09D11/102 ,  C08G59/06 ,  C08G2650/58 ,  C08K5/06 ,  C09D163/00

Abstract: A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and greater than 30 cps at a shear rate of 495 s−1 and a temperature of 25° C.

公开(公告)号：US20160060471A1

公开(公告)日：2016-03-03

申请号：US14471893

申请日：2014-08-28

Applicant: XEROX CORPORATION

Inventor： Yiliang Wu ,  Bryan A. Nerger

IPC: C09D11/102 ,  C08K5/06 ,  C09D163/00

CPC classification number: C09D11/102 ,  C08G59/06 ,  C08G2650/58 ,  C08K5/06 ,  C09D163/00

Abstract: A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and greater than 30 cps at a shear rate of 495 s−1 and a temperature of 25° C.

Abstract translation: 公开了一种焊接掩模油墨组合物。 焊料掩模油墨组合物包括环氧树脂; 相对于焊料掩模油墨组合物的总重量为至少20重量％的溶剂; 和任选的非离子表面活性剂。 油墨组合物在剪切速率为10s-1时的粘度小于1000cps，剪切速率为495s -1，温度为25℃时粘度大于30cps。