公开(公告)号：US10388541B2

公开(公告)日：2019-08-20

申请号：US15098278

申请日：2016-04-13

Applicant: XINTEC INC.

Inventor： Yu-Tung Chen ,  Quan-Qun Su ,  Chuan-Jin Shiu ,  Chien-Hui Chen ,  Hsiao-Lan Yeh ,  Yen-Shih Ho

IPC: H01L21/56 ,  H01L21/687 ,  H01L21/67 ,  H01L23/31 ,  H01L21/768 ,  H01L21/02 ,  H01L23/00

Abstract: A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.