公开(公告)号：US20140242742A1

公开(公告)日：2014-08-28

申请号：US14191348

申请日：2014-02-26

Applicant: XINTEC INC.

Inventor： Yi-Ming CHANG ,  Kuo-Hua LIU ,  Yi-Cheng WANG ,  Sheng-Yen CHANG

IPC: H01L31/0203 ,  H01L21/683

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: A wafer packaging method includes the following steps. A wafer having a plurality of integrated circuit units is provided. A first surface of the wafer opposite to the integrated circuit units is ground. A release layer is formed on a second surface of a light transmissive carrier. An ultraviolet temporary bonding layer is formed on the second surface of the light transmissive carrier or a third surface of the wafer. The ultraviolet temporary bonding layer is used to adhere the second surface of the light transmissive carrier to the third surface of the wafer. The first surface of the wafer is adhered to an ultraviolet tape. A fourth surface of the light transmissive carrier is exposed to ultraviolet to eliminate adhesion force of the ultraviolet temporary bonding layer. The light transmissive carrier and the release layer are removed.

Abstract translation: 晶片封装方法包括以下步骤。 提供具有多个集成电路单元的晶片。 与集成电路单元相对的晶片的第一表面被研磨。 剥离层形成在透光载体的第二表面上。 在透光载体的第二表面或晶片的第三表面上形成紫外线临时粘接层。 紫外线暂时接合层用于将透光载体的第二表面粘附到晶片的第三表面。 晶片的第一表面粘附到紫外线带上。 透光载体的第四表面暴露于紫外线以消除紫外线临时粘合层的粘附力。 去除透光载体和释放层。