Test structure and method for calibrating three-dimensional thermography fault isolation tool
    1.
    发明授权
    Test structure and method for calibrating three-dimensional thermography fault isolation tool 有权
    用于校准三维热成像故障隔离工具的测试结构和方法

    公开(公告)号:US09417309B1

    公开(公告)日:2016-08-16

    申请号:US14092588

    申请日:2013-11-27

    Applicant: Xilinx, Inc.

    CPC classification number: G01R35/005 G01R31/2896 G01R31/311

    Abstract: An apparatus for calibrating a three-dimensional thermography fault isolation tool, includes: a substrate having two or more pins; a first semiconductor die coupled to the substrate; a first heat generating test component at the first semiconductor die; and a second heat generating test component, wherein the first heat generating test component and the second heat generating test component are located at different respective heights; wherein the first heat generating test component is configured to produce a first temperature change in response to a voltage applied by the three-dimensional thermography fault isolation tool to the two or more pins; and wherein the second heat generating test component is configured to produce a second temperature change in response to the voltage or another voltage applied by the three-dimensional thermography fault isolation tool.

    Abstract translation: 一种用于校准三维热成像故障隔离工具的设备,包括:具有两个或更多个引脚的基板; 耦合到所述衬底的第一半导体管芯; 在第一半导体管芯处的第一发热测试部件; 以及第二发热试验部件,其中,所述第一发热试验部件和所述第二发热试验部件位于不同的高度处; 其中所述第一发热测试部件被配置为响应于由所述三维热成像故障隔离工具施加到所述两个或更多个引脚的电压而产生第一温度变化; 并且其中所述第二发热测试部件被配置为响应于由所述三维热成像故障隔离工具施加的电压或另一电压而产生第二温度变化。

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