公开(公告)号：US20140354965A1

公开(公告)日：2014-12-04

申请号：US13948860

申请日：2013-07-23

Applicant: Yayatech Co., Ltd.

Inventor： Ying-Cheng CHEN ,  Sheng-Feng Lin ,  Li-Chueh Chen ,  Yi-Chien Chen

IPC: G03F7/20

CPC classification number: G03F7/2041 ,  G01N21/9501 ,  G01N21/956 ,  H01L22/12

Abstract: The present invention discloses an immersion liquid replenishing apparatus, a replenishing method, and a wafer scribing lines inspection machine with the immersion liquid replenishing apparatus. The immersion liquid replenishing apparatus inputs an immersion liquid from a first pipe of the cover and outputs the immersion liquid from a second pipe of the bottom of a reservoir. The replenishing method comprises the steps of providing an immersion liquid replenishing apparatus, feeding an immersion liquid, forming a film, and discharging the immersion liquid. The production and preparation of the apparatus and method of the invention is convenient and cheap. During a process of wafer scribing lines inspection, the wafer scribing lines inspection machine with the immersion liquid replenishing apparatus has enough immersion liquid to form the film and discharges excess immersion liquid.

Abstract translation: 本发明公开了一种浸渍液补充装置，补充方法以及具有浸液补充装置的晶片划片线检查机。 浸没液体补充装置从盖的第一管输入浸没液，并从储存器底部的第二管输出浸液。 补充方法包括以下步骤：提供浸液补充装置，供给浸液，形成膜，以及排出浸液。 本发明的装置和方法的生产和制备方便且便宜。 在晶片划片线检查过程中，具有浸渍液补充装置的晶片划片线检查机具有足够的浸液以形成膜并排出多余的浸液。

公开(公告)号：US20140168635A1

公开(公告)日：2014-06-19

申请号：US13750347

申请日：2013-01-25

Applicant: YAYATECH CO., LTD.

Inventor： Sheng-Feng LIN ,  Chien-Cheng Chen ,  Kuei-Jung Chen ,  Li-Chueh Chen ,  Yi-Chien Chen

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/9505

Abstract: An inspection method and an inspection fixture for the scribing lines of a wafer are disclosed. The inspection method includes the following steps: providing a wafer having multiple chips and a lower surface attached with a dicing tape, wherein scribing lines are formed between the chips; connecting the dicing tape with a transparent carrier supporting a first liquid medium such that the dicing tape is contacted seamlessly with the first liquid medium, wherein the difference of refractive index between the first liquid medium and the dicing tape is less than 0.3; and inspecting the scribing lines through the transparent carrier from below the lower surface of the wafer by an inspection lens of an optical inspector. The inspection method and fixture increase the image resolution of the scribing lines so as to facilitate the detection of lower-surface defects of the scribing lines.

Abstract translation: 公开了一种用于晶片划线的检查方法和检查夹具。 检查方法包括以下步骤：提供具有多个芯片的晶片和附接有切割带的下表面，其中在所述芯片之间形成划线; 将切割带与支撑第一液体介质的透明载体连接，使得切割带与第一液体介质无缝接触，其中第一液体介质和切割带之间的折射率差小于0.3; 并且通过光学检查器的检查透镜从晶片的下表面的下方通过透明载体检查划线。 检查方法和夹具增加划线的图像分辨率，以便于检测划线的下表面缺陷。