公开(公告)号：US20140168635A1

公开(公告)日：2014-06-19

申请号：US13750347

申请日：2013-01-25

Applicant: YAYATECH CO., LTD.

Inventor： Sheng-Feng LIN ,  Chien-Cheng Chen ,  Kuei-Jung Chen ,  Li-Chueh Chen ,  Yi-Chien Chen

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/9505

Abstract: An inspection method and an inspection fixture for the scribing lines of a wafer are disclosed. The inspection method includes the following steps: providing a wafer having multiple chips and a lower surface attached with a dicing tape, wherein scribing lines are formed between the chips; connecting the dicing tape with a transparent carrier supporting a first liquid medium such that the dicing tape is contacted seamlessly with the first liquid medium, wherein the difference of refractive index between the first liquid medium and the dicing tape is less than 0.3; and inspecting the scribing lines through the transparent carrier from below the lower surface of the wafer by an inspection lens of an optical inspector. The inspection method and fixture increase the image resolution of the scribing lines so as to facilitate the detection of lower-surface defects of the scribing lines.

Abstract translation: 公开了一种用于晶片划线的检查方法和检查夹具。 检查方法包括以下步骤：提供具有多个芯片的晶片和附接有切割带的下表面，其中在所述芯片之间形成划线; 将切割带与支撑第一液体介质的透明载体连接，使得切割带与第一液体介质无缝接触，其中第一液体介质和切割带之间的折射率差小于0.3; 并且通过光学检查器的检查透镜从晶片的下表面的下方通过透明载体检查划线。 检查方法和夹具增加划线的图像分辨率，以便于检测划线的下表面缺陷。