公开(公告)号：US20250133696A1

公开(公告)日：2025-04-24

申请号：US18685617

申请日：2022-03-31

Applicant: ZTE Corporation

Inventor： Zhen SUN ,  Biying LI ,  Shuai LI ,  Qingsong XU

IPC: H05K7/20

Abstract: The present disclosure relates to the field of heat dissipation technologies, and provides a Vapor Chamber (VC) and an electronic device. The VC includes a first housing and a second housing that are disposed opposite to each other. The first housing and the second housing form a closed chamber. The first housing includes a bottom wall for making contact with a heat source. The second housing has a top wall facing the bottom wall. A first capillary structure is disposed on the bottom wall. The first capillary structure comprises a heat source region capillary structure and a non-heat source region capillary structure. The heat source region capillary structure includes a plurality of convex capillary structures and/or a plurality of first concave capillary structures.