公开(公告)号：US20250107043A1

公开(公告)日：2025-03-27

申请号：US18730899

申请日：2023-02-13

Applicant: ZTE CORPORATION

Inventor： Zhen SUN ,  Xiaoxue CHEN ,  Zhiwei DUAN ,  Qingsong XU

IPC: H05K7/20

Abstract: Disclosed are a vapor chamber, a radiator and an electronic device. The vapor chamber includes: a bottom plate, a top plate, a side plate and a backflow piece. The bottom plate includes a first heat dissipation area and a second heat dissipation area provided at a peripheral side of the first heat dissipation area. The first heat dissipation area is provided with at least a first capillary structure layer on the side near the top plate, and the second heat dissipation area is provided with at least a second capillary structure layer on the side near the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that in the first capillary structure layer.

公开(公告)号：US20250133696A1

公开(公告)日：2025-04-24

申请号：US18685617

申请日：2022-03-31

Applicant: ZTE Corporation

Inventor： Zhen SUN ,  Biying LI ,  Shuai LI ,  Qingsong XU

IPC: H05K7/20

Abstract: The present disclosure relates to the field of heat dissipation technologies, and provides a Vapor Chamber (VC) and an electronic device. The VC includes a first housing and a second housing that are disposed opposite to each other. The first housing and the second housing form a closed chamber. The first housing includes a bottom wall for making contact with a heat source. The second housing has a top wall facing the bottom wall. A first capillary structure is disposed on the bottom wall. The first capillary structure comprises a heat source region capillary structure and a non-heat source region capillary structure. The heat source region capillary structure includes a plurality of convex capillary structures and/or a plurality of first concave capillary structures.