公开(公告)号：US12264271B2

公开(公告)日：2025-04-01

申请号：US16812950

申请日：2020-03-09

Applicant: tesa SE

Inventor： Benjamin Pütz ,  Sarah Zimmermann

IPC: C09J7/38 ,  C08F18/08 ,  C08F220/06 ,  C08F220/18 ,  C09J123/02 ,  C09J133/08 ,  C09J169/00 ,  C09J193/04

Abstract: Pressure-sensitive adhesives, adhesive tapes, and methods enable high bond strengths on non-polar or rough substrates. The pressure-sensitive adhesives and methods comprise (a) at least one poly(meth)acrylate, (b) at least one resin A selected from colophony resins and terpene-phenolic resins, (c) at least one hydrocarbon resin B1 having a softening point of greater than 50° C., and (d) at least one hydrocarbon resin B2 having a softening point of less than or equal to 25° C. The adhesive tapes comprise one or more layers of the pressure-sensitive adhesives, and the methods may produce adhesive bonds on substrates with low surface energy and/or on substrates with a mean roughness of at least 5 μm.