公开(公告)号：US11500557B2

公开(公告)日：2022-11-15

申请号：US16745890

申请日：2020-01-17

Applicant: QUALCOMM TECHNOLOGIES, INC.

Inventor： Muthu M. Baskaran ,  Thomas Henretty ,  Ann Johnson ,  Athanasios Konstantinidis ,  M. H. Langston ,  Janice O. McMahon ,  Benoit J. Meister ,  Paul D. Mountcastle ,  Aale Naqvi ,  Benoit Pradelle ,  Tahina Ramananandro ,  Sanket Tavarageri ,  Richard A. Lethin

IPC: G06F9/44 ,  G06F3/06 ,  G06F8/41

Abstract: A compilation system using an energy model based on a set of generic and practical hardware and software parameters is presented. The model can represent the major trends in energy consumption spanning potential hardware configurations using only parameters available at compilation time. Experimental verification indicates that the model is nimble yet sufficiently precise, allowing efficient selection of one or more parameters of a target computing system so as to minimize power/energy consumption of a program while achieving other performance related goals. A voltage and/or frequency optimization and selection is presented which can determine an efficient dynamic hardware configuration schedule at compilation time. In various embodiments, the configuration schedule is chosen based on its predicted effect on energy consumption. A concurrency throttling technique based on the energy model can exploit the power-gating features exposed by the target computing system to increase the energy efficiency of programs.

公开(公告)号：US20220359338A1

公开(公告)日：2022-11-10

申请号：US17313412

申请日：2021-05-06

Applicant: QUALCOMM Technologies, Inc. ,  RF360 Europe GmbH

Inventor： Jose MOREIRA ,  Markus VALTERE ,  Bart KASSTEEN ,  Alberto Jose TEIXEIRA DE QUEIROS

IPC: H01L23/367 ,  H01L23/522 ,  H01L23/373 ,  H01L21/56 ,  H05K1/02

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.

公开(公告)号：US20220359337A1

公开(公告)日：2022-11-10

申请号：US17313380

申请日：2021-05-06

Applicant: QUALCOMM Technologies, Inc. ,  RF360 Europe GmbH

Inventor： Jose MOREIRA ,  Markus VALTERE ,  Juergen PORTMANN ,  Jeroen BIELEN

IPC: H01L23/367 ,  H01L23/522 ,  H05K1/02 ,  H01L23/373 ,  H01L23/31 ,  H01L21/56 ,  H03F3/213

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer. The plurality of heat sink interconnects is located adjacent the high-power die in a horizontal direction.

公开(公告)号：US11481469B2

公开(公告)日：2022-10-25

申请号：US14854839

申请日：2015-09-15

Applicant: QUALCOMM TECHNOLOGIES, INC.

Inventor： James Ezick ,  Thomas Henretty ,  Chanseok Oh ,  Jonathan Springer

IPC: G06N5/02 ,  G06N7/00 ,  G06N20/00 ,  G06F17/11 ,  G06F9/54

Abstract: We present the architecture of a high-performance constraint solver R-Solve that extends the gains made in SAT performance over the past fifteen years on static decision problems to problems that require on-the-fly adaptation, solution space exploration and optimization. R-Solve facilitates collaborative parallel solving and provides an efficient system for unrestricted incremental solving via Smart Repair. R-Solve can address problems in dynamic planning and constrained optimization involving complex logical and arithmetic constraints.

公开(公告)号：US20220285286A1

公开(公告)日：2022-09-08

申请号：US17191550

申请日：2021-03-03

Applicant: QUALCOMM Technologies Inc. ,  RF360 Europe GmbH

Inventor： Marc HUESGEN ,  Philipp Michael JAEGER

IPC: H01L23/552 ,  H01L23/49 ,  H01L23/48 ,  H01L23/367 ,  H01L23/373 ,  H01L21/768 ,  H01L21/56 ,  H01L21/48

Abstract: A package that includes a substrate, an integrated device coupled to the substrate, an encapsulation layer located over the substrate, at least one encapsulation layer interconnect located in the encapsulation layer, and a metal layer located over the encapsulation layer. The substrate includes at least one dielectric layer and a plurality of interconnects. The encapsulation layer interconnect is coupled to the substrate. The metal layer is configured as an electromagnetic interference (EMI) shield for the package. The metal layer is located over a backside of the integrated device.

公开(公告)号：US20220198747A1

公开(公告)日：2022-06-23

申请号：US17129362

申请日：2020-12-21

Applicant: Qualcomm Technologies, Inc.

Inventor： Kim SAVAROCHE

IPC: G06T17/00 ,  G06N3/04 ,  G06T7/50

Abstract: A method for annotating points on a 2D image of a hand, includes capturing several images of the hand from different views; for each viewpoint, the hand is imaged using cameras including: one first 2D camera and one 3D camera; using a 3D engine for: creating a 3D hand representation from the 3D camera; considering a 3D model of an articulated hand with predefined annotation points; considering several 3D viewpoints of the hand; for each viewpoint considered: modifying the articulated hand to be superimposed with the 3D representation; considering a 2D image captured from the first 2D camera; superimposing the modified articulated hand on the hand captured on the 2D image; applying the annotation points of the modified articulated hand on the hand captured on the 2D image; and storing the 2D image with annotation on the hand

公开(公告)号：US20220156514A1

公开(公告)日：2022-05-19

申请号：US17454743

申请日：2021-11-12

Applicant: QUALCOMM Technologies, Inc.

Inventor： Kirill GAVRILYUK ,  Mihir JAIN ,  Cornelis Gerardus Maria SNOEK

IPC: G06K9/62 ,  G06K9/46 ,  G06K9/00 ,  G06N3/08

Abstract: Certain aspects of the present disclosure provide techniques for training a first model based on a first labeled video dataset; generating a plurality of action-words based on output generated by the first model processing motion data in videos of an unlabeled video dataset; defining labels for the videos in the unlabeled video dataset based on the generated action-words; and training a second model based on the labels for the videos in the unlabeled video dataset.

公开(公告)号：US20220156502A1

公开(公告)日：2022-05-19

申请号：US17526969

申请日：2021-11-15

Applicant: QUALCOMM Technologies, Inc.

Inventor： Christen Maximilian FILTENBORG ,  Deepak Kumar GUPTA

IPC: G06K9/00 ,  G06F40/30 ,  G06K9/46

Abstract: A computer-implemented method for tracking with visual object constraints includes receiving a lingual constraint and a video. A word embedding is generated based on the lingual constraint. A set of features is extracted for one or more frames of the video. The word embedding is cross-correlated to the set of features for the one or more frames of the video. A prediction indicating whether the lingual constraint is in the one or more frames of the video is generated based on the cross-correlation.

公开(公告)号：US20220132050A1

公开(公告)日：2022-04-28

申请号：US17572510

申请日：2022-01-10

Applicant: QUALCOMM Technologies, Inc.

Inventor： Tom Frederik Hugo RUNIA ,  Cornelis Gerardus Maria SNOEK ,  Amold Wilhelmus Maria SMEULDERS

IPC: H04N5/272 ,  G06T7/00 ,  G06N3/04

Abstract: A method is presented. The method includes receiving a first sequence of frames depicting a dynamic element. The method also includes decomposing each spatial position from multiple spatial positions in the first sequence of frames to a frequency domain. The method further includes determining a distribution of spectral power density over a range of frequencies of the multiple spatial positions. The method still further includes generating a first set of feature maps based on the determined distribution of spectral power density over the range of frequencies. The method still further includes estimating a first physical property of the dynamic element.

公开(公告)号：US20210089923A1

公开(公告)日：2021-03-25

申请号：US17030361

申请日：2020-09-23

Applicant: QUALCOMM Technologies, Inc.

Inventor： Berkay KICANAOGLU ,  Taco Sebastiaan COHEN ,  Pim DE HAAN

IPC: G06N3/08 ,  G06N3/04 ,  G06T3/00

Abstract: A method for generating a convolutional neural network to operate on a spherical manifold, generates locally-defined gauges at multiple positions on the spherical manifold. A convolution is defined at each of the positions on the spherical manifold with respect to an arbitrarily selected locally-defined gauge. The results of the convolution that is defined at each position based on gauge equivariance is translated to obtain a manifold convolution.