公开(公告)号：US20090283884A1

公开(公告)日：2009-11-19

申请号：US12466655

申请日：2009-05-15

Applicant: Sung-il Kang ,  Chang-han Shim

Inventor： Sung-il Kang ,  Chang-han Shim

IPC: H01L23/495 ,  H01L21/60 ,  C23F1/00

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49534 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided are a lead frame, a semiconductor package, and a method of manufacturing the lead frame and the semiconductor package. The lead frame includes: a die pad on which a semiconductor chip is installable; a plurality of lead patterns formed around a circumference of the die pad; an insulating organic material filling etching spaces interposed between the die pad and the lead patterns and structurally supporting the die pad and the lead patterns; and a pre-plating layer formed on both upper and lower surfaces of the die pad and the lead patterns.

Abstract translation: 提供引线框架，半导体封装以及制造引线框架和半导体封装件的方法。 引线框架包括：可安装半导体芯片的管芯焊盘; 形成在所述管芯焊盘的周围的多个引线图案; 填充蚀刻空间的绝缘有机材料，其插入在所述管芯焊盘和引线图案之间，并且结构地支撑所述管芯焊盘和所述引线图案; 以及形成在管芯焊盘的上表面和下表面上的预镀层和引线图案。