公开(公告)号：US20240363547A1

公开(公告)日：2024-10-31

申请号：US18308866

申请日：2023-04-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chien-Yuan HUANG ,  Chuei-Tang Wang ,  Shih-Chang Ku

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L23/367 ,  H01L25/0655 ,  H01L25/50 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253

Abstract: A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over and electrically connected to the wiring substrate. The chip package structure includes a first anti-warpage structure bonded to the wiring substrate. The first anti-warpage structure is made of a semiconductor material and electrically insulated from a wiring structure of the wiring substrate and the chip package. The chip package structure includes a heat dissipation structure over the wiring substrate and surrounding the chip package and the first anti-warpage structure.

公开(公告)号：US12122251B2

公开(公告)日：2024-10-22

申请号：US18057890

申请日：2022-11-22

Applicant: Delphi Technologies IP Limited

Inventor： Jack Lavern Glenn ,  Mark Russell Keyse ,  Peter Allan Laubenstein ,  Srikanth Vijaykumar

IPC: B60L50/60 ,  B60L3/00 ,  B60L15/00 ,  B60L15/08 ,  B60L50/40 ,  B60L50/51 ,  B60L50/64 ,  B60L53/20 ,  B60L53/22 ,  B60L53/62 ,  B60R16/02 ,  G01R15/20 ,  G06F1/08 ,  G06F13/40 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/467 ,  H01L23/473 ,  H01L23/495 ,  H01L23/538 ,  H01L25/00 ,  H01L25/07 ,  H01L29/66 ,  H02J7/00 ,  H02M1/00 ,  H02M1/08 ,  H02M1/084 ,  H02M1/088 ,  H02M1/12 ,  H02M1/32 ,  H02M1/42 ,  H02M1/44 ,  H02M3/335 ,  H02M7/00 ,  H02M7/537 ,  H02M7/5387 ,  H02M7/5395 ,  H02P27/06 ,  H02P27/08 ,  H02P29/024 ,  H02P29/68 ,  H05K1/14 ,  H05K1/18 ,  H05K5/02 ,  H05K7/20 ,  B60L15/20 ,  H03K19/20

CPC classification number: B60L50/60 ,  B60L3/003 ,  B60L15/007 ,  B60L15/08 ,  B60L50/40 ,  B60L50/51 ,  B60L50/64 ,  B60L53/20 ,  B60L53/22 ,  B60L53/62 ,  B60R16/02 ,  G01R15/20 ,  G06F1/08 ,  G06F13/4004 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/5383 ,  H01L24/32 ,  H01L24/33 ,  H01L25/072 ,  H01L25/50 ,  H01L29/66553 ,  H02J7/0063 ,  H02M1/0009 ,  H02M1/0054 ,  H02M1/08 ,  H02M1/084 ,  H02M1/088 ,  H02M1/123 ,  H02M1/32 ,  H02M1/322 ,  H02M1/327 ,  H02M1/4258 ,  H02M1/44 ,  H02M3/33523 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H02M7/53871 ,  H02M7/53875 ,  H02M7/5395 ,  H02P27/06 ,  H02P27/08 ,  H02P27/085 ,  H02P29/024 ,  H02P29/027 ,  H02P29/68 ,  H05K1/145 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0247 ,  H05K7/20154 ,  H05K7/2049 ,  H05K7/20854 ,  H05K7/209 ,  H05K7/20927 ,  B60L15/20 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2210/42 ,  B60L2210/44 ,  B60L2240/36 ,  G06F2213/40 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H02J2207/20 ,  H02P2207/05 ,  H03K19/20 ,  H05K2201/042 ,  H05K2201/10166

Abstract: A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic interface configured to separate a high voltage area from a low voltage area; a low voltage message manager in the low voltage area; a high voltage message manager in the high voltage area, and configured to communicate with the low voltage message manager; and a point-of-use message manager in the high voltage area, and configured to communicate with the high voltage message manager.

公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US20240321850A1

公开(公告)日：2024-09-26

申请号：US18463789

申请日：2023-09-08

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

Inventor： Yusuke IMAIZUMI ,  Jia LIU ,  Yoshinari TAMURA

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L25/18 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/33 ,  H01L24/49 ,  H01L27/01 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/49175

Abstract: According to one embodiment, an isolator includes an isolator module including a first substrate, a first insulating layer in contact with a top surface of the first substrate, a second insulating layer in contact with a bottom surface of the first substrate, a first coil arranged at a same height as the first insulating layer, and a second coil arranged at a same height as the second insulating layer and facing the first coil; a first conductor arranged below the isolator module and electrically connected to a bottom surface of the second coil; and a first chip, wherein the second coil and a top surface of the first chip are electrically connected to each other with the first conductor interposed.

公开(公告)号：US20240321663A1

公开(公告)日：2024-09-26

申请号：US18187924

申请日：2023-03-22

Applicant: WOLFSPEED, INC.

Inventor： Afshin DADVAND ,  Dev BALARAMAN

IPC: H01L23/31 ,  B05D1/12 ,  B05D1/26 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L23/3135 ,  B05D1/12 ,  B05D1/26 ,  H01L21/565 ,  H01L23/291 ,  H01L23/296 ,  H01L24/32 ,  H01L24/48 ,  B05D2430/00 ,  B05D2505/50 ,  B05D2601/00 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2924/12032 ,  H01L2924/13091

Abstract: A device may include device parts, a composite coating material arranged on one or more of the device parts, and a molding compound arranged on and/or around one or more of the device parts. Moreover, the device may include where the composite coating material may include a polymer matrix including and/or incorporating ceramic particles.

公开(公告)号：US20240312875A1

公开(公告)日：2024-09-19

申请号：US18243080

申请日：2023-09-06

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

Inventor： Rie ARIMA ,  Kazuki MATSUO ,  Masaru IZUMISAWA

IPC: H01L23/482 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/482 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/41 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40991 ,  H01L2224/4103 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/49111 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/13091

Abstract: According to one embodiment, a semiconductor device includes a metal base, a terminal separated from the metal base, a semiconductor chip including a back-surface-side electrode connected to the metal base and a front-surface-side electrode provided on a front surface opposite to the back-surface-side electrode, a connection member including a first end portion connected to the front-surface-side electrode of the semiconductor chip and a second end portion connected to the terminal, and a conductive member provided on the front-surface-side electrode of the semiconductor chip and covering a region of the front-surface-side electrode that is not connected to the first end portion of the connection member.

公开(公告)号：US20240312861A1

公开(公告)日：2024-09-19

申请号：US18607298

申请日：2024-03-15

Applicant: JCET Group Co. Ltd.

Inventor： Chen XU ,  JianYong WU ,  Shuo LIU

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/92225

Abstract: Disclosed are a three-dimensional package structure and a method for forming the same. The method includes: flip-mounting the first die onto the first substrate; mounting the heat conductive plate onto the first substrate, such that bottom portions of the two vertical plates of the heat conductive plate are attached onto a surface of the first substrate and the lateral plate is attached onto a surface, away from the first substrate, of the first die; mounting the second substrate over the first substrate, such that top portions of the two vertical plates of the heat conductive plate are respectively embedded into the two openings; filling up a space between the first substrate and the second substrate with a molding layer; flip-mounting the second die onto a surface of the second substrate; and mounting the heat sink, such that the heat sink encircles an outer surface of the second die.

公开(公告)号：US12094801B2

公开(公告)日：2024-09-17

申请号：US16917542

申请日：2020-06-30

Applicant: NXP USA, Inc.

Inventor： Lakshminarayan Viswanathan ,  Jaynal A Molla

IPC: H01L23/48 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3736 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/29083 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/29144 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/29139 ,  H01L2924/00014 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014

Abstract: A semiconductor device and a method of manufacturing the same include a die and a planar thermal layer, and a thick-silver layer disposed directly onto a first planar side of the planar thermal layer, as well as a metallurgical die-attach disposed between the thick-silver layer and the die, the metallurgical die-attach directly contacting the thick-silver layer.

公开(公告)号：US12094725B2

公开(公告)日：2024-09-17

申请号：US17546960

申请日：2021-12-09

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/54 ,  H01L21/78 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/78 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/83 ,  H05K1/111 ,  H05K1/181 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2224/83444 ,  H01L2924/01047 ,  H01L2224/85444 ,  H01L2924/01047 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/48105 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US20240304528A1

公开(公告)日：2024-09-12

申请号：US18599704

申请日：2024-03-08

Applicant: Infineon Technologies Austria AG

Inventor： Ralf Otremba ,  Leo Aichriedler ,  Daniel Hölzl ,  Gerald Wriessnegger ,  Soumya Susovita Nayak

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/11 ,  H01L25/16

CPC classification number: H01L23/49562 ,  H01L23/49555 ,  H01L23/49568 ,  H01L24/40 ,  H01L24/48 ,  H01L25/112 ,  H01L25/117 ,  H01L25/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/48245 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13062 ,  H01L2924/13091

Abstract: A power transistor chip package includes a power transistor chip having a first load electrode on a first side, a second load electrode on a second (opposite) side, and a control electrode. The power transistor chip is disposed on a chip pad, with the first side facing the pad and the first load electrode electrically connected to the pad. An encapsulation body encapsulates the power transistor chip and includes a footprint side, a top (opposite) side, and side faces extending between the footprint and top sides. A first package load terminal is electrically connected to the first load electrode. Part I and part II second package load terminals are both electrically connected directly to the second load electrode. A package control terminal is electrically connected to the control electrode. The part I and part II second package load terminals are aligned with opposite sides faces of the encapsulation body.