公开(公告)号：US20060221922A1

公开(公告)日：2006-10-05

申请号：US11321313

申请日：2005-12-29

Applicant: Ming-Chieh Chen ,  Chien-Chung Kao ,  Ming-Chih Tsai ,  Chun-Chie Lai

Inventor： Ming-Chieh Chen ,  Chien-Chung Kao ,  Ming-Chih Tsai ,  Chun-Chie Lai

IPC: H04Q7/24

CPC classification number: H04L29/06027 ,  H04L65/605 ,  H04W92/02

Abstract: A communication system includes a wireless network terminal (30), a wired network terminal (10), and a communication device (20). The communication device includes a Local Area Network (LAN) controller module (22), a process unit (24) and a transcoder (26). When the wired network terminal transmits a first kind of signal input to the communication device, the first kind of input signal is processed by the process unit and transformed into a first kind of output signal by the transcoder. Then the first kind of output is transmitted to the wireless network terminal. When the wireless network terminal transmits a second kind of signal input to the communication device. The second kind of input signal is transformed into the second kind of output signal by the transcoder. The second kind of output signal is processed by the process unit, and is then transmitted to the wired network terminal.

Abstract translation: 通信系统包括无线网络终端（30），有线网络终端（10）和通信设备（20）。 通信设备包括局域网（LAN）控制器模块（22），处理单元（24）和代码转换器（26）。 当有线网络终端向通信设备发送输入的第一种信号时，由处理单元处理第一类输入信号，并通过代码转换器将其转换为第一类输出信号。 然后将第一种输出发送到无线网络终端。 当无线网络终端向通信设备发送输入的第二种信号时。 第二种输入信号由代码转换器转换成第二种输​​出信号。 第二种输出信号由处理单元处理，然后发送到有线网络终端。

公开(公告)号：US20060113654A1

公开(公告)日：2006-06-01

申请号：US11328316

申请日：2006-01-10

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

IPC: H01L23/02

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。