公开(公告)号：US07969469B2

公开(公告)日：2011-06-28

申请号：US11947980

申请日：2007-11-30

Applicant: R. Michael Guidash

Inventor： R. Michael Guidash

IPC: H04N5/225 ,  H04N13/02

CPC classification number: H04N5/265 ,  H04N5/2258 ,  H04N5/272 ,  H04N5/335

Abstract: A primary integrated image sensor is operatively connected to one or more secondary image sensors. The primary integrated image sensor includes a pixel array integrated on a semiconductor substrate along with one or more of an image signal processing circuit, readout circuitry, a digital serial interface, storage, a timing circuit, an analog-to-digital converter, and a bi-directional digital input/output circuit. Each secondary image sensor can be implemented as a Complementary Metal Oxide Semiconductor (CMOS) or a Charge Coupled Device (CCD) image sensor and include a pixel array along with one or more of a readout circuitry, a digital serial interface, a timing circuit, an output circuit, and an optional analog-to-digital converter. Images captured by the primary integrated image sensor and each secondary image sensor are processed by the primary image sensor. Each secondary image sensor can also transmit physical and operational data to the primary integrated image sensor.

Abstract translation: 主集成图像传感器可操作地连接到一个或多个次级图像传感器。 主集成图像传感器包括集成在半导体衬底上的像素阵列以及图像信号处理电路，读出电路，数字串行接口，存储器，定时电路，模数转换器和 双向数字输入/输出电路。 每个次级图像传感器可以实现为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD）图像传感器，并且包括像素阵列以及读出电路，数字串行接口，定时电路中的一个或多个， 输出电路和可选的模数转换器。 由主要集成图像传感器和每个次级图像传感器捕获的图像由主图像传感器处理。 每个次级图像传感器还可以将物理和操作数据传送到主要集成图像传感器。

公开(公告)号：US20090141146A1

公开(公告)日：2009-06-04

申请号：US11947980

申请日：2007-11-30

Applicant: R. Michael Guidash

Inventor： R. Michael Guidash

IPC: H04N5/76

CPC classification number: H04N5/265 ,  H04N5/2258 ,  H04N5/272 ,  H04N5/335

Abstract: A primary integrated image sensor is operatively connected to one or more secondary image sensors. The primary integrated image sensor includes a pixel array integrated on a semiconductor substrate along with one or more of an image signal processing circuit, readout circuitry, a digital serial interface, storage, a timing circuit, an analog-to-digital converter, and a bi-directional digital input/output circuit. Each secondary image sensor can be implemented as a Complementary Metal Oxide Semiconductor (CMOS) or a Charge Coupled Device (CCD) image sensor and include a pixel array along with one or more of a readout circuitry, a digital serial interface, a timing circuit, an output circuit, and an optional analog-to-digital converter. Images captured by the primary integrated image sensor and each secondary image sensor are processed by the primary image sensor. Each secondary image sensor can also transmit physical and operational data to the primary integrated image sensor.

Abstract translation: 主集成图像传感器可操作地连接到一个或多个次级图像传感器。 主集成图像传感器包括集成在半导体衬底上的像素阵列以及图像信号处理电路，读出电路，数字串行接口，存储器，定时电路，模数转换器和 双向数字输入/输出电路。 每个次级图像传感器可以实现为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD）图像传感器，并且包括像素阵列以及读出电路，数字串行接口，定时电路中的一个或多个， 输出电路和可选的模数转换器。 由主要集成图像传感器和每个次级图像传感器捕获的图像由主图像传感器处理。 每个次级图像传感器还可以将物理和操作数据传送到主要集成图像传感器。