公开(公告)号：US08373984B2

公开(公告)日：2013-02-12

申请号：US13102055

申请日：2011-05-06

Applicant: Chun-Wang Lin ,  Yu-Han Tsai

Inventor： Chun-Wang Lin ,  Yu-Han Tsai

IPC: H05K5/00 ,  H05K7/00

CPC classification number: G06F1/1632

Abstract: A docking station includes a connector, a first sliding component whereon a first incline and at least one incline are formed, and a second sliding component whereon a third incline is formed. When the second sliding component moves in a first direction so that the third incline slides relative to the first incline, the second sliding component pushes the first sliding component in a second direction for driving the connector to electrically connect with a notebook computer. The second sliding component further includes at least one protrusion. When the second sliding component moves in a third direction opposite to the first direction so that the protrusion slides relative to the second incline, the protrusion drives the first sliding component to move in a fourth direction opposite to the second direction so as to drive the connector to separate from the notebook computer.

Abstract translation: 对接站包括连接器，形成有第一倾斜和至少一个倾斜的第一滑动部件和形成第三倾斜部的第二滑动部件。 当第二滑动部件沿第一方向移动使得第三斜面相对于第一倾斜部滑动时，第二滑动部件沿第二方向推动第一滑动部件，用于驱动连接器以与笔记本计算机电连接。 第二滑动部件还包括至少一个突起。 当第二滑动部件沿与第一方向相反的第三方向移动，使得突起相对于第二倾斜部滑动时，突起驱动第一滑动部件沿与第二方向相反的第四方向移动，以驱动连接器 与笔记本电脑分离。

公开(公告)号：US20130337645A1

公开(公告)日：2013-12-19

申请号：US13525568

申请日：2012-06-18

Applicant: Hsin-Yu Chen ,  Yu-Han Tsai ,  Chun-Ling Lin ,  Ching-Li Yang ,  Home-Been Cheng

Inventor： Hsin-Yu Chen ,  Yu-Han Tsai ,  Chun-Ling Lin ,  Ching-Li Yang ,  Home-Been Cheng

IPC: H01L21/768

CPC classification number: H01L21/76898

Abstract: A method of processing a substrate is provided. The method includes: providing a substrate, wherein the substrate includes a silicon layer; etching the substrate to form a cavity; filling a first conductor in part of the cavity; performing a first thermal treatment on the first conductor; filling a second conductor in the cavity to fill-up the cavity; and performing a second thermal treatment on the first conductor and the second conductor.

Abstract translation: 提供了一种处理衬底的方法。 该方法包括：提供衬底，其中衬底包括硅层; 蚀刻基板以形成空腔; 在腔的一部分中填充第一导体; 对所述第一导体执行第一热处理; 在腔中填充第二导体以填充空腔; 以及对所述第一导体和所述第二导体执行第二热处理。

公开(公告)号：US20100328906A1

公开(公告)日：2010-12-30

申请号：US12578698

申请日：2009-10-14

Applicant: Yu-Han TSAI ,  Chun-Wang LIN ,  Yu-Hsien HUANG ,  Chi-Jen LO ,  Feng-Hsiung WU

Inventor： Yu-Han TSAI ,  Chun-Wang LIN ,  Yu-Hsien HUANG ,  Chi-Jen LO ,  Feng-Hsiung WU

IPC: H05K5/00

CPC classification number: H05K5/061

Abstract: An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone.

Abstract translation: 电子设备包括：第一和第二壳体，配合形成内接收空间; 设置在内部接收空间中的主板，由分隔线划分成具有至少一个输入/输出连接器的端口区域和非端口区域; 第一和第二防水条分别设置在第一壳体和母板之间以及第二壳体和主板之间，并且设置在分隔线处，第二防水条带具有相对的端部，其形成有相应的延伸部分，其垂直于第一防水 剥离并设置在母板的周边边缘; 以及第三防水条，其连接到所述第一防水条以与其形成封闭的密封环，设置在所述第一和第二壳体之间，并且设置在所述非端口区的外围边缘的外侧。

公开(公告)号：US08900996B2

公开(公告)日：2014-12-02

申请号：US13528867

申请日：2012-06-21

Applicant: Hsin-Yu Chen ,  Home-Been Cheng ,  Yu-Han Tsai ,  Ching-Li Yang

Inventor： Hsin-Yu Chen ,  Home-Been Cheng ,  Yu-Han Tsai ,  Ching-Li Yang

IPC: H01L23/485

CPC classification number: H01L23/481 ,  H01L21/7684 ,  H01L21/76898 ,  H01L23/522 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating a through silicon via (TSV) structure is provided, in which, a first dielectric layer is formed on the substrate, the first dielectric layer is patterned to have at least one first opening, a via hole is formed in the first dielectric layer and the substrate, a second dielectric layer is conformally formed on the first dielectric layer, the second dielectric layer has at least one second opening corresponding to the at least one first opening, and the second dielectric layer covers a sidewall of the via hole. A conductive material layer is formed to fill the via hole and the second opening. The conductive material layer is planarized to form a TSV within the via hole. A TSV structure is also provided, in which, the second dielectric layer is disposed within the first opening and on the sidewall of the via hole.

Abstract translation: 提供了一种通过硅通孔（TSV）结构制造方法，其中在基片上形成第一介电层，将第一介电层图案化成具有至少一个第一开口，在第一介电层中形成通孔 电介质层和衬底，第二电介质层共形地形成在第一电介质层上，第二电介质层具有至少一个对应于至少一个第一开口的第二开口，并且第二电介质层覆盖通孔的侧壁 。 形成导电材料层以填充通孔和第二开口。 导电材料层被平坦化以在通孔内形成TSV。 还提供了一种TSV结构，其中第二电介质层设置在通孔的第一开口和侧壁内。

公开(公告)号：US08691688B2

公开(公告)日：2014-04-08

申请号：US13525568

申请日：2012-06-18

Applicant: Hsin-Yu Chen ,  Yu-Han Tsai ,  Chun-Ling Lin ,  Ching-Li Yang ,  Home-Been Cheng

Inventor： Hsin-Yu Chen ,  Yu-Han Tsai ,  Chun-Ling Lin ,  Ching-Li Yang ,  Home-Been Cheng

IPC: H01L21/44

CPC classification number: H01L21/76898

Abstract: A method of processing a substrate is provided. The method includes: providing a substrate, wherein the substrate includes a silicon layer; etching the substrate to form a cavity; filling a first conductor in part of the cavity; performing a first thermal treatment on the first conductor; filling a second conductor in the cavity to fill-up the cavity; and performing a second thermal treatment on the first conductor and the second conductor.

Abstract translation: 提供了一种处理衬底的方法。 该方法包括：提供衬底，其中衬底包括硅层; 蚀刻基板以形成空腔; 在腔的一部分中填充第一导体; 对所述第一导体执行第一热处理; 在腔中填充第二导体以填充空腔; 以及对所述第一导体和所述第二导体执行第二热处理。

公开(公告)号：US08116074B2

公开(公告)日：2012-02-14

申请号：US12725472

申请日：2010-03-17

Applicant: Yu-Han Tsai ,  Chun-Wang Lin ,  Feng-Hsiung Wu ,  Chi-Jen Lo

Inventor： Yu-Han Tsai ,  Chun-Wang Lin ,  Feng-Hsiung Wu ,  Chi-Jen Lo

IPC: G06F1/16

CPC classification number: G06F1/187 ,  H05K5/0295

Abstract: A removable mechanism for drawing an object from a housing is disclosed. The removable mechanism includes a first rail disposed inside the housing and on a side of the object for guiding the object to move inside the housing. The removable mechanism further includes a driving rod installed on the first rail in a movable manner for driving the object to move in a first direction, and a pull rod pivoted to the driving rod for pulling the driving rod to drive the object to move in the first direction so as to eject from the housing when being rotated out of the housing and being pulled.

Abstract translation: 公开了一种用于从壳体中拉出物体的可移除机构。 可移动机构包括设置在壳体内部和物体侧面上的引导物体在壳体内移动的第一轨道。 可移除机构还包括以可移动的方式安装在第一轨道上的驱动杆，用于驱动物体沿第一方向移动;以及拉杆，其枢转到驱动杆，用于拉动驱动杆以驱动物体在 第一方向，以便在从壳体旋转出并拉出时从壳体弹出。

公开(公告)号：US20110273838A1

公开(公告)日：2011-11-10

申请号：US13102055

申请日：2011-05-06

Applicant: Chun-Wang Lin ,  Yu-Han Tsai

Inventor： Chun-Wang Lin ,  Yu-Han Tsai

IPC: H05K7/10

CPC classification number: G06F1/1632

Abstract: A docking station includes a connector, a first sliding component whereon a first incline and at least one incline are formed, and a second sliding component whereon a third incline is formed. When the second sliding component moves in a first direction so that the third incline slides relative to the first incline, the second sliding component pushes the first sliding component in a second direction for driving the connector to electrically connect with a notebook computer. The second sliding component further includes at least one protrusion. When the second sliding component moves in a third direction opposite to the first direction so that the protrusion slides relative to the second incline, the protrusion drives the first sliding component to move in a fourth direction opposite to the second direction so as to drive the connector to separate from the notebook computer.

Abstract translation: 对接站包括连接器，形成有第一倾斜和至少一个倾斜的第一滑动部件和形成第三倾斜部的第二滑动部件。 当第二滑动部件沿第一方向移动使得第三斜面相对于第一倾斜部滑动时，第二滑动部件沿第二方向推动第一滑动部件，用于驱动连接器以与笔记本计算机电连接。 第二滑动部件还包括至少一个突起。 当第二滑动部件沿与第一方向相反的第三方向移动，使得突起相对于第二倾斜部滑动时，突起驱动第一滑动部件沿与第二方向相反的第四方向移动，以驱动连接器 与笔记本电脑分离。