公开(公告)号：US20240067795A1

公开(公告)日：2024-02-29

申请号：US18501345

申请日：2023-11-03

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Toru SASAKI ,  Masahide YODOGAWA

IPC: C08K3/04 ,  C08F14/26

CPC classification number: C08K3/041 ,  C08F14/26 ,  B29B7/48

Abstract: To provide resin compositions excellent in electrical conductivity and flexibility. A resin composition comprising a fluororesin and a carbon nanostructure, wherein the carbon nanostructure includes a plurality of carbon nanotubes that are branched and share a common wall with each other.

公开(公告)号：US20210040252A1

公开(公告)日：2021-02-11

申请号：US17070132

申请日：2020-10-14

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Wataru KASAI ,  Toru SASAKI ,  Masatoshi ABE

IPC: C08F214/26 ,  B32B27/30 ,  C09J135/00 ,  C09J7/35 ,  C09J7/25 ,  H05K3/38 ,  C09J127/18 ,  B32B7/12 ,  B32B15/08 ,  B32B37/06 ,  C09J5/06 ,  C23F1/00 ,  H05K1/03 ,  H05K3/06

Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

公开(公告)号：US20200009840A1

公开(公告)日：2020-01-09

申请号：US16571888

申请日：2019-09-16

Applicant: AGC Inc.

Inventor： Shigeru AIDA ,  Toru SASAKI

IPC: B32B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32

Abstract: To provide a fluororesin laminate in which a layer of a fluorinated copolymer and a layer of a propylene polymer excellent in heat resistance are strongly attached.A laminate comprising a layer which contains a fluorinated copolymer having an adhesive functional group and having monomer unit based on tetrafluoroethylene and monomer units based on ethylene, and a layer which contains a propylene polymer having an adhesive functional group.