CORRECTING COMPONENT FAILURES IN ION IMPLANT SEMICONDUCTOR MANUFACTURING TOOL

    公开(公告)号:US20200251360A1

    公开(公告)日:2020-08-06

    申请号:US16264034

    申请日:2019-01-31

    Abstract: Methods, systems, and non-transitory computer readable medium are provided for correcting component failures in ion implant semiconductor manufacturing tool. A method includes receiving, from sensors associated with an ion implant tool, current sensor data corresponding to features; performing feature analysis to generate additional features for the current sensor data; providing the additional features as input to a trained machine learning model; obtaining one or more outputs from the trained machine learning model, where the one or more outputs are indicative of a level of confidence of a predicted window; predicting, based on the level of confidence of the predicted window, whether one or more components of the ion implant tool are within a pre-failure window; and responsive to predicting that the one or more components are within the pre-failure window, performing a corrective action associated with the ion implant tool.

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