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公开(公告)号:US20240081481A1
公开(公告)日:2024-03-14
申请号:US18272976
申请日:2021-01-21
Applicant: ASICS CORPORATION
Inventor: Chihaya SUZUKI , Seiji YANO , Hiroki NAKAMURA , Satoru ABE , Sho TAKAMASU
IPC: A43B23/02
CPC classification number: A43B23/0245
Abstract: An upper includes an upper body covering the instep of a foot. An upper body includes a first layer, a second layer disposed with a gap from the first layer, and a third layer connecting the first layer and the second layer. A part of the upper body is disposed with a low stiffness region having lower stiffness than an adjacent region. At least a part of the low stiffness region has a point in which the third layer is not disposed. A plurality of holes is disposed in at least a part of a portion of the first layer and the second layer of the low stiffness region corresponding to the point in which the third layer is not disposed.
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公开(公告)号:US20240000184A1
公开(公告)日:2024-01-04
申请号:US18039669
申请日:2020-12-16
Applicant: ASICS CORPORATION
Inventor: Shingo TAKASHIMA , Norihiko TANIGUCHI , Yuya KOZUKA , Genki HATANO , Satoru ABE , Masanori SAKAGUCHI , Hisashi MAEJIMA , Seiji YANO , Takayuki UEDA , Katsunori YAGYU
CPC classification number: A43B13/146 , A43B13/145 , A43B7/144
Abstract: A sole structure of a shoe includes a rearfoot-side concave-shaped portion including a vertex region in a bottom surface of the sole in a rearfoot region. The vertex region is positioned at a highest position within the bottom surface of the sole in the rearfoot region and configured to be positioned at a position corresponding to a center of a heel of a wearer such that center of pressure of the wearer overlaps with the center of the heel.
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公开(公告)号:US20230240408A1
公开(公告)日:2023-08-03
申请号:US18002637
申请日:2020-06-26
Applicant: ASICS CORPORATION
Inventor: Masanori SAKAGUCHI , Hiroaki NISHIMURA , Tomoki ISHIZASHI , Kenji HIRATA , Seiji YANO , Seigo NAKAYA
Abstract: A shoe sole 1 includes a bottom part 20 and a deformation restraining part 30. The bottom part 20 includes: a rear bottom surface part 24 formed to extend from a rearfoot to a midfoot portion and to be, when the shoe sole is placed on a virtual surface S as a flat surface, in contact with the virtual surface S; and a toe portion 26 of which a height from the virtual surface S is set to 100% or greater and 250% or less with respect to a thickness in the rear bottom surface part 24. The deformation restraining part 30 is disposed in an edge part on a medial side and a lateral side of the bottom part 20 and extends from a forefoot to the midfoot portion along the bottom part 20. The deformation restraining part 30 has higher hardness than the bottom part 20.
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公开(公告)号:US20230075713A1
公开(公告)日:2023-03-09
申请号:US17822414
申请日:2022-08-25
Applicant: ASICS CORPORATION
Inventor: Chihaya SUZUKI , Seiji YANO , Katsunori YAGYU , Yoshiyasu ANDO , Keita OZAWA , Yousuke ATARASHI , Shingo MASUMOTO , Hiroaki NISHIMURA , Kenta TATENO
IPC: A43B23/02
Abstract: An upper includes an upper main body that covers an instep of a foot. A first region and a second region adjacent to the first region are formed in the upper main body . The upper main body includes: a first linear body provided across the first region and the second region or provided only in the second region; and a second linear body provided in the first region while avoiding the second region and having an end located at a boundary portion between the first region and the second region. The first linear body and the second linear body have mutually different stretchability.
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