公开(公告)号：US12033923B2

公开(公告)日：2024-07-09

申请号：US17023267

申请日：2020-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Tsung Chiu ,  Hui-Ying Hsieh ,  Chun Hao Chiu ,  Chiuan-You Ding

IPC: H01L23/495

CPC classification number: H01L23/49558 ,  H01L23/49503 ,  H01L23/49527 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/023 ,  H01L2924/19011

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a lead frame and passive component. The lead frame includes a paddle and a plurality of leads. The lead frame includes a first surface and a second surface opposite to the first surface. The passive component includes an external connector. A pattern of the external connector is corresponding to a pattern of the plurality of leads of the lead frame.

公开(公告)号：US10186467B2

公开(公告)日：2019-01-22

申请号：US15649545

申请日：2017-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Bernd Karl Appelt ,  Kay Stefan Essig ,  Chi-Tsung Chiu

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/768 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/48 ,  H01L23/14

Abstract: A semiconductor package device includes a first die, an adhesive layer, and an encapsulant layer. The first die comprises a first electrode at a first surface of the first die and a second electrode at a second surface of the first die opposite to the first surface of the first die. The adhesive layer is disposed on the first surface of the first die. The encapsulant layer encapsulates the first die and the adhesive layer, wherein substantially an entire surface of the second electrode is exposed from the encapsulant layer.