公开(公告)号：US10236208B2

公开(公告)日：2019-03-19

申请号：US15184828

申请日：2016-06-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chin-Cheng Kuo ,  Pao-Nan Lee ,  Chih-Pin Hung ,  Ying-Te Ou

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/522 ,  H01L23/528 ,  H01L23/00

Abstract: The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.