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公开(公告)号:US20200311142A1
公开(公告)日:2020-10-01
申请号:US16368677
申请日:2019-03-28
Applicant: Amazon Technologies, Inc.
IPC: G06F16/901 , G06F16/27
Abstract: Technology is described for using spatial analysis of data objects associated with a multi-dimensional virtual environment to organize computational units in a distributed computing system. The data objects may be grouped together using spatial location information and collections of data objects may be treated as processing partitions (i.e., sub-divisions of the entire group of data objects). A mapping may be created between the data objects and processing partitions for processing applications which process data objects assigned to a processing partition. The processing partitions may be defined, in part, according to how the data objects are grouped together spatially. The processing partitions may be load-balanced across hardware hosts in the distributed computing system.