公开(公告)号：US20220094053A1

公开(公告)日：2022-03-24

申请号：US17026974

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Yi Jiang ,  Jiangfeng Wu ,  Siwen Yong ,  Hao Xu ,  Ana Papio Toda ,  Carlo di Nallo ,  Michael D. Quinones ,  Mattia Pascolini ,  Amin Tayebi ,  Aaron J. Cooper ,  Per Jakob Helander ,  Johan Avendal

IPC: H01Q3/30 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.

公开(公告)号：US20210328334A1

公开(公告)日：2021-10-21

申请号：US16849776

申请日：2020-04-15

Applicant: Apple Inc.

Inventor： Aaron J. Cooper ,  Amin Tayebi ,  Carlo di Nallo ,  Ana Papio Toda

IPC: H01Q1/42 ,  H01Q1/52 ,  H01Q3/44 ,  H01Q1/24

Abstract: An electronic device may be provided with an antenna for receiving signals in first and second ultra-wideband communications bands. The antenna may include a shielding ring that runs around first and second arms. The first arm may radiate in the first band and the second arm may radiate in the second band. The first arm may have an end formed from a first segment of the ring and a radiating edge facing the second arm. The second arm may have an end formed from a second segment of the ring and a radiating edge facing the first arm. First and second sets of conductive vias may couple the ring to ground. The first set may form a return path for the first arm. The second set may form a return path for the second arm.