公开(公告)号：US20190208648A1

公开(公告)日：2019-07-04

申请号：US16297439

申请日：2019-03-08

Applicant: Apple Inc.

Inventor： Ming Kun Shi ,  Lindsay D. Corbet ,  Christopher Bruni ,  Collin D. Chan

IPC: H05K5/00 ,  H05K5/06 ,  H01Q1/22 ,  H05K5/02 ,  H01Q1/42

CPC classification number: H05K5/0004 ,  H01Q1/22 ,  H01Q1/42 ,  H05K5/0217 ,  H05K5/062

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.

公开(公告)号：US10264685B2

公开(公告)日：2019-04-16

申请号：US15888658

申请日：2018-02-05

Applicant: Apple Inc.

Inventor： Ming Kun Shi ,  Lindsay D. Corbet ,  Christopher Bruni ,  Collin D. Chan

IPC: H05K5/00 ,  H05K5/02 ,  H05K5/06 ,  H01Q1/22 ,  H01Q1/42

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.

公开(公告)号：US20180160551A1

公开(公告)日：2018-06-07

申请号：US15888658

申请日：2018-02-05

Applicant: Apple Inc.

Inventor： Ming Kun Shi ,  Lindsay D. Corbet ,  Christopher Bruni ,  Collin D. Chan

IPC: H05K5/00 ,  H05K5/06 ,  H01Q1/22 ,  H01Q1/42 ,  H05K5/02

CPC classification number: H05K5/0004 ,  H01Q1/22 ,  H01Q1/42 ,  H05K5/0217 ,  H05K5/062

Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.