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公开(公告)号：US10953433B2
公开(公告)日：2021-03-23
申请号：US16440883
申请日：2019-06-13
Applicant: Apple Inc.
Inventor： William F. Leggett , Ming Kun Shi , Christopher Bruni , Simon Regis Louis Lancaster-Larocque
IPC: B05D5/00 , B05D1/36 , B05D3/06 , B32B37/24 , B32B37/30 , B32B43/00 , B29C73/02 , B29C65/48 , B29C65/00 , B32B38/00 , B29C73/10
Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.
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公开(公告)号：US20200221583A1
公开(公告)日：2020-07-09
申请号：US16820513
申请日：2020-03-16
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US20170094811A1
公开(公告)日：2017-03-30
申请号：US15280465
申请日：2016-09-29
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
CPC classification number: H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US10897825B2
公开(公告)日：2021-01-19
申请号：US16820513
申请日：2020-03-16
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US10350634B2
公开(公告)日：2019-07-16
申请号：US14815499
申请日：2015-07-31
Applicant: Apple Inc.
Inventor： William F. Leggett , Ming Kun Shi , Christopher Bruni , Simon Regis Louis Lancaster-Larocque
IPC: B29C65/00 , B29C65/02 , B32B37/00 , B32B38/00 , B29C73/00 , B32B43/00 , B32B38/14 , B32B38/04 , C23C14/54 , B05D3/00 , B05D5/00 , B05D1/36 , B05D3/06 , B32B37/24 , B32B37/30 , B29C73/02 , B29C65/48 , B29C73/10
Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.
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Patent Agency Ranking
公开(公告)号：US09907191B2
公开(公告)日：2018-02-27
申请号：US15280465
申请日：2016-09-29
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
CPC classification number: H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.
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公开(公告)号：US09710023B2
公开(公告)日：2017-07-18
申请号：US14834315
申请日：2015-08-24
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Jason O. Mettler , Hilbert T. Kwan , Christopher Bruni , Qi Tian , Jing Zhang , Howard E. Bujtor , Stephen V. Jayanathan , Houtan R. Farahani
IPC: G06F1/16
CPC classification number: G06F1/1656 , G06F1/1688
Abstract: Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.
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公开(公告)号：US20170028438A1
公开(公告)日：2017-02-02
申请号：US14815499
申请日：2015-07-31
Applicant: Apple Inc.
Inventor： William F. Leggett , Ming Kun Shi , Christopher Bruni , Simon Regis Louis Lancaster-Larocque
CPC classification number: B05D5/00 , B05D1/36 , B05D3/06 , B29C65/48 , B29C66/0222 , B29C66/242 , B29C66/41 , B29C73/02 , B29C73/10 , B32B37/24 , B32B37/30 , B32B43/00 , B32B2038/0064 , B32B2457/00
Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.
Abstract translation: 公开了修改衬底表面轮廓的方法。 方法包括在衬底的临界配合表面上沉积填充材料，以使得配合表面更适合与匹配的衬底。 填充材料可以沉积在配合表面上的特征或缺陷周围或周围，使得实现最终期望的表面轮廓。 在某些情况下，配合表面的最终表面轮廓是平面的。 当它们连接在一起时，这可以防止与衬底和匹配衬底之间形成的特征或缺陷相关的间隙。 可以通过将配合表面的尺寸与参考表面的尺寸进行比较来确定配合表面的最终表面轮廓。 在某些情况下，使用喷墨印刷技术将填料材料精确地沉积在规定的位置并具有精确的厚度控制。
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公开(公告)号：US20160202732A1
公开(公告)日：2016-07-14
申请号：US14834315
申请日：2015-08-24
Applicant: Apple Inc.
Inventor： Ming Kun Shi , Jason O. Mettler , Hilbert T. Kwan , Christopher Bruni , Qi Tian , Jing Zhang , Howard E. Bujtor , Stephen V. Jayanathan , Houtan R. Farahani
CPC classification number: G06F1/1656 , G06F1/1688
Abstract: Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.
Abstract translation: 公开了用于形成穿孔结构的穿孔结构和方法。 穿孔结构包括部分穿过基底的部分孔或盲孔。 部分孔可以靠近穿过基底的通孔定位。 部分孔向穿孔基材增加机械强度。 描述了用于改变部分孔的光学外观的方法，使得部分孔看起来与通孔不可区分，这允许在多孔结构内设计美观吸引人的图案的灵活性。
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公开(公告)号：US20190291133A1
公开(公告)日：2019-09-26
申请号：US16440883
申请日：2019-06-13
Applicant: Apple Inc.
Inventor： William F. Leggett , Ming Kun Shi , Christopher Bruni , Simon Regis Louis Lancaster-Larocque
Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.
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