公开(公告)号：US20230361154A1

公开(公告)日：2023-11-09

申请号：US18180763

申请日：2023-03-08

Applicant: Apple Inc.

Inventor： Ziruo Hong ,  Ganghun Kim ,  Jun Qi ,  Rong Liu ,  Saijin Liu ,  Tongbi T Jiang ,  Victor H Yin

IPC: H01L27/15

CPC classification number: H01L27/156

Abstract: An electronic device may have one or more displays that produce images for a user. The display may include an array of light-emitting diodes. Each light-emitting diode in the array of light-emitting diodes may include a plurality of vias. The vias may be arranged in an array of rows and columns. The light-emitting diodes in the array may share a common cathode. The common cathode may include a conductive layer formed from a reflective material. The conductive layer may be formed in a grid that defines a plurality of openings for the light-emitting diodes or may be formed around the periphery of the array. The array may include light-emitting diodes of two different colors in a head-to-tail arrangement, connected in series, or that share a common cathode. The array may include light-emitting diodes of three different colors that are vertically stacked.

公开(公告)号：US11573351B2

公开(公告)日：2023-02-07

申请号：US16812152

申请日：2020-03-06

Applicant: Apple Inc.

Inventor： Saahil Mehra ,  Jacky G. Ko ,  Saijin Liu

IPC: H02J7/00 ,  G01V8/12 ,  G04G21/02 ,  G04G19/00 ,  H02J50/10 ,  A61B5/00 ,  H02J7/02 ,  A61B5/024

Abstract: An electronic watch includes a frame and a cover. The cover is attached to the frame, and the frame and cover at least partially define an interior volume of the electronic watch. An optical sensor assembly including a light emitter and a light receiver is positioned within the inter volume of the frame. An optical barrier is positioned between the optical sensor assembly and the cover and includes a magnetic material that forms a light blocking-wall between the light emitter and the light receiver. The magnetic material is configured to removably couple the electronic watch with a charging device via a magnetic attraction between the magnetic material and a magnetic component of the charging device.

公开(公告)号：US20220254941A1

公开(公告)日：2022-08-11

申请号：US17174076

申请日：2021-02-11

Applicant: Apple Inc.

Inventor： Mathieu Charbonneau-Lefort ,  Saahil Mehra ,  Tongbi T. Jiang ,  Saijin Liu

IPC: H01L31/0352 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203

Abstract: An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.

公开(公告)号：US20220085231A1

公开(公告)日：2022-03-17

申请号：US17473745

申请日：2021-09-13

Applicant: Apple Inc.

Inventor： Saijin Liu ,  Tongbi T. Jiang ,  Saahil Mehra

IPC: H01L31/167 ,  H02J50/10 ,  G06F1/16 ,  G04G21/02 ,  G04C10/00 ,  A61B5/00

Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.