公开(公告)号：US20190036201A1

公开(公告)日：2019-01-31

申请号：US16147703

申请日：2018-09-29

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

IPC: H01Q1/24 ,  H04M1/02 ,  G06F1/16 ,  B29C45/14 ,  B29C37/00 ,  B29L31/34

CPC classification number: H01Q1/243 ,  B29C37/0082 ,  B29C45/14311 ,  B29C45/14467 ,  B29L2031/34 ,  B29L2031/3437 ,  G06F1/1626 ,  G06F1/1633 ,  G06F1/1656 ,  G06F2200/1633 ,  H04M1/0249 ,  H04M1/0283

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.