公开(公告)号：US20220293635A1

公开(公告)日：2022-09-15

申请号：US17529969

申请日：2021-11-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chenyang Zhang ,  Fuqiang Li ,  Xue Dong ,  Meili Wang ,  Xuan Liang ,  Fei Wang ,  Mingxing Wang ,  Zhanfeng Cao ,  Yanling Han ,  Xinxin Zhao

IPC: H01L27/12

Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.