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公开(公告)号:US12278213B2
公开(公告)日:2025-04-15
申请号:US17422220
申请日:2020-10-21
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Mingxing Wang , Meng Yan , Qingxun Zhang , Qian Wu , Xuan Feng , Xiawei Yun , Guangcai Yuan , Xue Dong , Muxin Di , Zhiwei Liang , Ke Wang
IPC: H01L27/15 , H01L23/00 , H01L23/498 , H01L25/065 , H10K59/35
Abstract: A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.
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公开(公告)号:US12216816B2
公开(公告)日:2025-02-04
申请号:US17788448
申请日:2021-06-18
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenhao Tian , Lei Wang , Xuan Feng
IPC: G06F3/01
Abstract: Provided is a wearable display module including a display panel, a plurality of light-emitting elements, a plurality of photoelectric sensor assemblies, and an optical structure. The display panel includes a display region and a peripheral region surrounding the display region. The light-emitting elements are configured to emit light to be irradiated to eyes of a user. The photoelectric sensor assemblies are disposed in the peripheral region, each of the photoelectric sensor assemblies being configured to receive optical signals reflected via the eyes of the user, and convert the optical signals into electric signals. The optical structure is disposed on a side of the photoelectric sensor assembly, and the optical structure includes a light shielding region and a plurality of light transmitting regions, wherein each of the light-transmitting regions at least is configured to transmit the optical signal to a photoelectric sensor assembly corresponding to the light transmitting regions.
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公开(公告)号:US20220293576A1
公开(公告)日:2022-09-15
申请号:US17536268
申请日:2021-11-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Meili Wang , Xuan Liang , Fei Wang , Lei Wang , Yafeng Yang , Xue Dong , Zhanfeng Cao , Mingxing Wang , Fuqiang Li , Chenyang Zhang , Xinxin Zhao , Yanling Han , Lei Wang , Xuan Feng , Yapeng Li
IPC: H01L25/16 , H01L33/62 , H01L27/146 , H01L21/66
Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.
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