DRIVING BACKPLANE AND DISPLAY APPARATUS

    公开(公告)号:US20220093540A1

    公开(公告)日:2022-03-24

    申请号:US17356772

    申请日:2021-06-24

    Abstract: The present disclosure provides a driving backplane and a display apparatus. The driving backplane includes: a substrate, and signal wires, binding electrodes and connection wires arranged on the substrate; at least one of the signal wires extends in a first direction; a first end of any one of the connection wires is electrically connected with at least one of the binding electrodes, and a second end of any one of the connection wires is electrically connected with one of the signal wires; a wire width of at least one of the connection wires at the first end is smaller than a wire width at the second end; and at least one of the connection wires includes: a first straight wire portion extending in the first direction, and an oblique wire portion with an extending direction forming a certain included angle with the first direction.

    DRIVING BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

    公开(公告)号:US20220068980A1

    公开(公告)日:2022-03-03

    申请号:US17213939

    申请日:2021-03-26

    Abstract: Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0

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