公开(公告)号：US10906832B2

公开(公告)日：2021-02-02

申请号：US16057284

申请日：2018-08-07

Applicant: Corning Incorporated

Inventor： Marina Irmgard Heiss ,  Uwe Stute ,  Ralf Joachim Terbrueggen

IPC: C03B33/02 ,  B23K26/06 ,  B23K26/073 ,  B23K26/082 ,  B23K26/067 ,  B23K26/53 ,  B23K26/364 ,  C03B33/09 ,  B23K103/00

Abstract: A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.