公开(公告)号：US08393739B2

公开(公告)日：2013-03-12

申请号：US12482993

申请日：2009-06-11

申请人： Chao-Nan Chien ,  Wei-Cheng Lo ,  Nien-Hui Hsu

发明人： Chao-Nan Chien ,  Wei-Cheng Lo ,  Nien-Hui Hsu

IPC分类号： G03B21/16 ,  F21V29/00

CPC分类号： G03B21/16

摘要： A heat-dissipating device used in a projection display apparatus with an air outlet includes a fence module, at least one resilient member, and a shape memory alloy module. The fence module is disposed at the air outlet and includes at least one guiding plate with a pivot. The resilient member exerts a first force on the guiding plate to enable the guiding plate to rotate on the pivot, and the shape memory alloy module deforms when heated to exert a second force on the guiding plate to enable the guiding plate to rotate on the pivot.

摘要翻译： 在具有空气出口的投影显示装置中使用的散热装置包括挡板模块，至少一个弹性构件和形状记忆合金模块。 挡板模块设置在空气出口处，并且包括具有枢轴的至少一个引导板。 弹性构件在引导板上施加第一力，以使引导板能够在枢轴上旋转，并且形状记忆合金模块在被加热时变形，以在引导板上施加第二力，以使引导板能够在枢轴上旋转 。

公开(公告)号：US20100320908A1

公开(公告)日：2010-12-23

申请号：US12659590

申请日：2010-03-15

申请人： Nien-Hui Hsu ,  Chao-Nan Chien ,  Ken-Chih Chang ,  Tung-Min Lee

发明人： Nien-Hui Hsu ,  Chao-Nan Chien ,  Ken-Chih Chang ,  Tung-Min Lee

IPC分类号： H05B37/02

CPC分类号： H05B33/089 ,  H05B33/0854

摘要： A power supply module is formed as a package body suitable to be assembled in a light emitting diode illumination apparatus. The power supply module includes a light emitting diode driver, a feedback control unit, a current converting unit, and a package material. The light emitting diode driver, the feedback control unit, and the current converting unit are packaged integrally by the package material. The current converting unit is suitable for supplying power to the light emitting diode driver and the feedback control unit. The feedback control unit is suitable to receive a feedback signal from a light source module disposed outside of the package body and provide an adjusting signal to the light emitting diode driver, so as to make the light emitting diode driver to adjust the magnitude of a control current and provide the control current to the light source module.

摘要翻译： 电源模块形成为适合于组装在发光二极管照明装置中的封装体。 电源模块包括发光二极管驱动器，反馈控制单元，电流转换单元和封装材料。 发光二极管驱动器，反馈控制单元和电流转换单元由封装材料整体封装。 电流转换单元适用于向发光二极管驱动器和反馈控制单元供电。 反馈控制单元适于从设置在封装主体外部的光源模块接收反馈信号，并向发光二极管驱动器提供调整信号，以使发光二极管驱动器调节控制的幅度 并向光源模块提供控制电流。

公开(公告)号：US20080247168A1

公开(公告)日：2008-10-09

申请号：US12055591

申请日：2008-03-26

申请人： Chao-Nan Chien ,  Wei-Cheng Lo

发明人： Chao-Nan Chien ,  Wei-Cheng Lo

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21V29/004 ,  F21V29/713 ,  F21V29/76 ,  F21V29/777 ,  F21V29/89 ,  F28F3/02

摘要： A light valve device includes a light valve disposed adjacent to a circuit board, and a heat-dissipating structure including a heat-dissipating main body and a heat-dissipating block. The heat-dissipating main body is disposed opposite to the light valve, and is formed with a groove defined by a first contacting surface and two engaging surfaces. The first contacting surface extends in a longitudinal direction perpendicular to the vertical direction and has two opposite longitudinal edges. The engaging surfaces respectively extend from the longitudinal edges and define an open side of the groove opposite to the first contacting surface in the vertical direction. The open side has a width in the transverse direction smaller than that of the first contacting surface. An engaging portion of the heat-dissipating block is disposed in the groove so that a second contacting surface is in contact with the first contacting surface.

摘要翻译： 光阀装置包括邻近电路板设置的光阀，以及包括散热主体和散热块的散热结构。 散热主体与光阀相对设置，并且形成有由第一接触表面和两个接合表面限定的凹槽。 第一接触表面在垂直于垂直方向的纵向方向上延伸并且具有两个相对的纵向边缘。 接合表面分别从纵向边缘延伸并且在垂直方向上限定与第一接触表面相对的凹槽的开口侧。 开口侧的宽度方向小于第一接触面的宽度。 散热块的接合部设置在槽中，使得第二接触面与第一接触面接触。