公开(公告)号：US20220077054A1

公开(公告)日：2022-03-10

申请号：US17469831

申请日：2021-09-08

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hunt Hang Jiang ,  Xiuhong Guo

IPC: H01L23/528 ,  H01L23/31 ,  H01L23/532 ,  H01L25/065

Abstract: An IC package structure and an IC package unit are disclosed. The IC package includes an array of metal wall grids formed into a panel, each one of the metal wall grids having a continuous and closed metal wall to surround an IC package unit with at least one IC chip/IC die disposed therein. Each IC chip/IC die has a top surface with a plurality of metal pads formed thereon. A panel-shaped metal layer is formed on entire back side of the panel of the array of metal wall grids and bonded to the metal wall of each metal wall grid. A panel-shaped rewiring substrate having a plurality of metal pillars is connected to each IC chip/IC die with each one of the plurality of metal pillars soldered with a corresponding one of the plurality of metal pads.