公开(公告)号：US20070012428A1

公开(公告)日：2007-01-18

申请号：US11164458

申请日：2005-11-23

申请人： Zhan Wu ,  Chun-Chi Chen ,  Shi-Wen Zhou

发明人： Zhan Wu ,  Chun-Chi Chen ,  Shi-Wen Zhou

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.

摘要翻译： 散热装置包括翅片组，将热量传递到翅片组的不同部分的弯曲热管和与热管接触的基部。 热管在U形部分的两侧分别具有中间的U形部分和两个L形部分。 基座用于与发热电子装置接触并将热量从电子装置传递到热管和散热片组。 翅片组定义在其中间的通道。 热管的U形部分容纳在翅片组的通道中，并与翅片组热接合。

公开(公告)号：US07447025B2

公开(公告)日：2008-11-04

申请号：US11163820

申请日：2005-11-01

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.

摘要翻译： 散热装置（1）包括散热器（10），风扇（20）和空气冷却部件（30）。 通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。 空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

公开(公告)号：US20070159798A1

公开(公告)日：2007-07-12

申请号：US11306700

申请日：2006-01-09

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F28F2215/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.

摘要翻译： 散热装置包括散热体和与散热装置热结合的​​导热体。 散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。 每个翅片在其一端分支多个部分。 导热体包括热嵌合在散热体的中心部分的通孔中的柱。 在该散热体的中心部分之间限定空腔。 空腔中含有相变介质，一旦该塔从发热电子设备中吸收热量，该腔就变成蒸汽。

公开(公告)号：US20060158850A1

公开(公告)日：2006-07-20

申请号：US11244688

申请日：2005-10-06

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu ,  Bing-Wen Zhou ,  Hong-Wei Du

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu ,  Bing-Wen Zhou ,  Hong-Wei Du

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F2215/00 ,  H01L23/4006 ,  H01L23/467 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.

摘要翻译： 散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。 散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。 气缸包括四个互连的侧面。 同一侧的翅片彼此平行。 两个热管热量围绕散热器的气缸并且完全接触散热器。

公开(公告)号：US07397663B2

公开(公告)日：2008-07-08

申请号：US11309345

申请日：2006-07-28

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Zhan Wu

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.

摘要翻译： 夹具包括主体，致动构件，第一钩板和第二钩板。 主体包括支撑部分和从支撑部分的相对侧延伸的一对间隔开的臂。 致动构件包括支撑在支撑部上的凸轮。 第一钩板可拆卸地联接到主体的臂的远端。 第二钩板延伸穿过支撑部分并且枢转地联接到致动构件的凸轮。 致动构件可相对于第二钩板在锁定位置和解锁位置之间转动。

公开(公告)号：US07342795B2

公开(公告)日：2008-03-11

申请号：US11244916

申请日：2005-10-05

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.

摘要翻译： 散热器组件包括散热器（10），从扩展器延伸的多个散热片（12），紧固件（20）和固定到紧固件的固定套管（30）。 紧固件包括具有螺纹底端（208）的头部（200）和轴（204）。 套筒包括圆柱形壁（302），上开口端（304）和下开口端（306）。 套筒还具有与壁垂直连接并在下开口端延伸的环形基座（308）。 头部被接收在墙壁上并接触基座。 轴延伸穿过吊具。 压头弹簧（22）在头部和吊具之间提供，用于向下推动吊具以与发热电子装置接合。

公开(公告)号：US20080010788A1

公开(公告)日：2008-01-17

申请号：US11309220

申请日：2006-07-13

申请人： CHUN-CHI CHEN ,  Shi-Wen Zhou ,  Zhan Wu

发明人： CHUN-CHI CHEN ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： A44B21/00 ,  H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44 ,  Y10T24/44017 ,  H01L2924/00

摘要： A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.

摘要翻译： 夹具包括具有第一端和第二端的本体。 连接构件延伸穿过主体的第一端。 钩板附接到连接构件的底部，并且致动构件枢转地联接到连接构件的上端。 致动构件可相对于钩板在第一方向上枢转，使得致动构件相对于钩板可在锁定位置和解锁位置之间转动。 此外，致动构件可在不同于第一方向的第二方向上围绕连接构件的轴线转动。

公开(公告)号：US20070217162A1

公开(公告)日：2007-09-20

申请号：US11309758

申请日：2006-09-22

申请人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Zhan Wu

发明人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Zhan Wu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink and a back plate assembly thermally independent from the sink. The back plate assembly includes a body facing a bottom surface of the heat sink and a heat-dissipating member thermal connecting to the body. The heat sink is used for absorbing heat generated by a heat-generating electronic component from a top side thereof. The back plate assembly is used for absorbing the heat generated by the heat-generating electronic component from a bottom side thereof. The heat sink and the back plate assembly are connected together by fixing members extending from the heat sink through a printed circuit board on which the electronic component is mounted to threadedly engage with the back plate assembly.

摘要翻译： 散热装置包括散热器和与散热器热独立的背板组件。 背板组件包括面向散热器的底表面的主体和连接到主体的散热构件。 散热器用于从其顶侧吸收由发热电子部件产生的热量。 背板组件用于从其底侧吸收由发热电子部件产生的热量。 散热器和背板组件通过从散热器延伸的固定部件通过印刷电路板连接在一起，电路板安装在印刷电路板上，以与背板组件螺纹接合。

公开(公告)号：US20070145572A1

公开(公告)日：2007-06-28

申请号：US11306412

申请日：2005-12-27

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H01L23/34

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.

摘要翻译： 散热装置（1）包括散热器（10），风扇（20）和冷却构件（30）。 散热器包括基座，从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。 冷却件在其上设置有翅片组件，并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分，以使翅片的一侧和冷凝部分具有较低的温度。

公开(公告)号：US07610950B2

公开(公告)日：2009-11-03

申请号：US11557917

申请日：2006-11-08

申请人： Jun Cao ,  Zhan Wu ,  Shi-Wen Zhou

发明人： Jun Cao ,  Zhan Wu ,  Shi-Wen Zhou

IPC分类号： H01L23/427 ,  F28D15/02

CPC分类号： H01L23/467 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.

摘要翻译： 一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管 ）连接在第一基板上并延伸穿过翅片组。 第一和第二热管中的每一个包括吸收部分和消散部分。 第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以 从第一基板到散热片组的更多不同的散热路径。